Lens driving device, and camera module and optical device, which include same

ABSTRACT

An embodiment comprises: a housing; a bobbin, accommodated inside the housing, for mounting a lens; a first coil arranged on an outer peripheral surface of the bobbin; magnets arranged in the housing; a coil board that comprises second coils arranged below the housing and arranged so as to be spaced from each other, and connection parts connected to the second coils; a circuit board, which is arranged below the coil board and comprises first pad parts arranged at locations corresponding to the connection parts; and a conductive adhesive member for bonding the connection part and the first pad part, which correspond to each other, wherein each of the connection parts comprises a groove part depressed from the outer surface of the coil board, and exposing any one corresponding upper surface among the first pad parts, and a bonding part prepared around the groove part, and the conductive adhesive member is arranged on the upper surface of the bonding part and on the upper surface of the first pad part exposed by the groove part and electrically connects the bonding part with the first pad part.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/951,651, filed Nov. 18, 2020; which is a continuation of U.S.application Ser. No. 16/319,063, filed Jan. 18, 2019, now U.S. Pat. No.10,871,701, issued Dec. 22, 2020; which is the U.S. national stageapplication of International Patent Application No. PCT/KR2017/007399,filed Jul. 11, 2017; which claims the benefit under 35 U.S.C. § 119 ofKorean Application Nos. 10-2016-0092608, filed Jul. 21, 2016, and10-2016-0123835, filed Sep. 27, 2016; the disclosures of each of whichare incorporated herein by reference in their entirety.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus and to a camera module andan optical device each including the same.

BACKGROUND ART

Technology of a voice coil motor (VCM), which is used in existinggeneral camera modules, is difficult to apply to a micro-scale,low-power camera module, and studies related thereto have been activelyconducted.

The demand for electronic products, such as smartphones and cellularphones equipped with cameras, is increasing. The trend is for a camerafor a cellular phone to become high-resolution and miniaturized, and theassociated actuator is correspondingly developed so as to realizeminiaturization, a large aperture and multiple functions. In order torealize a high-resolution camera for a cellular phone, there are demandsfor increased performance of the camera for a cellular phone and foradditional functions, such as autofocusing, reduction in shaking of ashutter, zooming and the like.

DISCLOSURE Technical Problem

Embodiments provide a lens moving apparatus capable of inhibitingelectrical short between solders and support members, damage to bondingportions of a coil board and generation of cracks in solders, and acamera module and an optical device each including the lens movingapparatus.

Furthermore, embodiments provides a lens moving apparatus, which isprovided with a mechanical stopper for a housing disposed in a drivingdirection of the housing, and a camera module and an optical device eachincluding the lens apparatus.

Technical Solution

A lens moving apparatus according to an embodiment comprises a housing;a bobbin accommodated in the housing, a lens being mounted on thebobbin; a first coil disposed on an outer peripheral surface of thebobbin; magnets disposed on the housing; a coil board comprising secondcoils disposed under the housing so as to be spaced apart from eachother and connectors connected to the second coils; a circuit boarddisposed under the coil board and comprising first pads disposed atpositions corresponding to the connectors; and a conductive adhesivemember for bonding the first pads to the corresponding connectors,wherein each of the connectors comprises a recess, which is depressedfrom an outer surface of the coil board so as to expose an upper surfaceof a corresponding one of the first pads, and a bonding portion disposednear the recess, and wherein the conductive adhesive member is disposedon an upper surface of the bonding portion and an upper surface of thefirst pad which is exposed through the recess so as to conductivelyconnect the bonding portion to the first pad.

The conductive adhesive member may be solder or conductive paste, theconductive adhesive member may be spaced apart from an outer surface ofthe circuit board and positioned inside the outer surface of the circuitboard, and the conductive adhesive member may protrude from an uppersurface of the coil board in a direction toward the coil board from thecircuit board.

The bonding portion of the coil board may be disposed so as to bealigned with a corresponding one of the first pads in a directionparallel to an optical axis.

A lower surface of the conductive adhesive member may cover the uppersurface of the pad of the circuit board and the upper surface of thebonding portion of the coil board, and an upper surface of theconductive adhesive member may be positioned higher than an uppersurface of the coil board.

The lens moving apparatus may further include upper elastic memberscoupled both to an upper portion of the bobbin and to an upper portionof the housing; a lower elastic member coupled both to a lower portionof the bobbin and to a lower portion of the housing; and support membersdisposed on side portions of the housing, wherein each of the supportmembers include an upper terminal portion, a lower terminal portion, andan elastic deformation portion connecting the upper terminal portion tothe lower terminal portion, and wherein each of the upper terminalportions of the support members is connected to a corresponding one ofthe upper elastic members.

The circuit board may further include second pads, which are spacedapart from the first pads and connected to at least one of the lowerterminal portions of the support members, at least one side of an uppersurface of the circuit board may be provided with two first pads, whichare spaced apart from each other, and two second pads, which are spacedapart from each other, and the two second pads may be positioned betweenthe two first pads.

The coil board may further include wires or patterns connecting thesecond coils to the bonding portions of the connectors.

The recess may be provided in a first region of at least one side of anupper surface of the coil board, the at least one side of the uppersurface of the coil board may be provided with a second region, which isa remaining region excluding the first region, and the first region isdepressed lower than the second region.

A first surface of the conductive adhesive member that faces toward theouter surface of the circuit board may be a flat surface, a secondsurface of the conductive adhesive member may be a curved surface, andthe second surface of the conductive adhesive member may face the firstsurface of the conductive adhesive member.

The lens moving apparatus may further include a cover member including atop plate and a side plate; and a base disposed under the circuit board,wherein the housing comprises a stopper protruding from an upper surfaceof a corner of the housing, wherein the cover member comprises adepressed portion, which is formed by depressing a corner of the topplate, and wherein the stopper overlaps at least part of the depressedportion in a direction perpendicular to an optical axis.

Advantageous Effects

Embodiments are capable of inhibiting electrical shorts between soldersand support members, damage to bonding portions of a coil board andgeneration of cracks in solders.

Furthermore, embodiments are capable of reducing stroke dispersion of ahousing and making hole calibration easy, thereby improving feedbackcontrol in handshaking correction.

DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic perspective view of a lens moving apparatusaccording to an embodiment;

FIG. 2 is an exploded perspective view of the lens moving apparatusillustrated in FIG. 1 ;

FIG. 3 is a perspective view of the lens moving apparatus from which acover member is removed;

FIG. 4 is a first perspective view of a bobbin, a first coil, a firstposition sensor, first magnets and a second magnet, which areillustrated in FIG. 1 ;

FIG. 5 is a plan view of FIG. 4 ;

FIG. 6 is a first perspective view of a housing illustrated in FIG. 1 ;

FIG. 7 is a second perspective view of the housing illustrated in FIG. 1;

FIG. 8 is an assembled perspective view of the bobbin, the firstmagnets, the housing, a lower elastic member and a support member, whichare illustrated in FIG. 1 ;

FIG. 9 is a perspective view of an upper elastic member illustrated inFIG. 1 ;

FIG. 10 is a perspective view of the lower elastic member illustrated inFIG. 1 ;

FIG. 11 is a cross-sectional view taken along line I-I′ of FIG. 3 ;

FIG. 12 is an exploded perspective view of a second coil, a circuitboard and a base;

FIG. 13 is an assembled perspective view of a second coil, the circuitboard and the base illustrated in FIG. 12 ;

FIG. 14 is an enlarged view of a dotted rectangular area of FIG. 13 ;

FIG. 15 is a view showing a conductive adhesive member for bonding firstpads to bonding portions illustrated in FIG. 14 ;

FIG. 16 a is a view showing general bonding between the circuit boardand a coil board;

FIG. 16 b is an enlarged view of a first bonding portion illustrated inFIG. 16 a;

FIG. 16 c is an enlarged view of a second bonding portion of FIG. 16 a;

FIG. 17 a is a view showing bonding between the circuit board and thecoil board according to the embodiment;

FIG. 17 b is an enlarged view of a first bonding region in FIG. 17 a;

FIG. 17 c is an enlarged view of a second bonding region in FIG. 17 a;

FIG. 18 is a perspective view of a lens moving apparatus according toanother embodiment;

FIG. 19 is an exploded perspective view of the lens moving apparatusillustrated in FIG. 18 ;

FIG. 20 is an exploded perspective view of some components of the lensmoving apparatus illustrated in FIG. 19 ;

FIG. 21 is a cross-sectional view taken along line X1-X2 in FIG. 18 ;

FIGS. 22 and 23 are exploded perspective views of some components of thelens moving apparatus illustrated in FIG. 19 ;

FIG. 24 is a perspective view of a lens moving apparatus according to afurther embodiment;

FIG. 25 is an exploded perspective view of the lens moving apparatusillustrated in FIG. 24 ;

FIG. 26 is an exploded perspective view of some components of the lensmoving apparatus illustrated in FIG. 25 ;

FIG. 27 is a perspective view of the lens moving apparatus illustratedin FIG. 24 , from which a cover member 1100 a is removed;

FIG. 28 is a cross-sectional view taken along line Y1-Y2 in FIG. 24 ;

FIG. 29 is an exploded perspective view of a camera module according toan embodiment;

FIG. 30 is a perspective view illustrating a portable terminal accordingto an embodiment; and

FIG. 31 is a view illustrating the configuration of the portableterminal illustrated in FIG. 30 .

BEST MODE

Hereinafter, embodiments will be clearly elucidated via descriptionthereof with reference to the accompanying drawings. In the followingdescription of the embodiments, it will be understood that, when anelement such as a layer (film), region, pattern, or structure isreferred to as being “on” or “under” another element, it can be“directly” on or under the other element, or can be “indirectly” formedsuch that an intervening element may also be present. In addition, itwill also be understood that the meaning of “on” and “under” aredetermined on the basis of the drawings. The same reference numbers willbe used throughout the drawings to refer to the same or like parts.

Hereinafter, a lens moving apparatus according to an embodiment will bedescribed with reference to the accompanying drawings. For theconvenience of description, although the lens moving apparatus will bedescribed using a rectangular coordinate system (x, y, z), the lensmoving apparatus may be described using some other coordinate systems,and the embodiment is not limited thereto. In the respective drawings,the X-axis and the Y-axis mean directions perpendicular to an opticalaxis, i.e. the Z-axis, and the optical axis (Z-axis) direction may bereferred to as a “first direction”, the X-axis direction may be referredto as a “second direction”, and the Y-axis direction may be referred toas a “third direction”.

A “handshake correction device”, which is applied to a subminiaturecamera module of a mobile device such as, for example, a smart phone ora tablet PC, may be a device that is configured to inhibit the contourline of a captured image from being indistinctly formed due to vibrationcaused by shaking of the user's hand when capturing a still image.

In addition, an “auto-focusing device” is a device that automaticallyfocuses an image of a subject on an image sensor surface. The handshakecorrection device and the auto-focusing device may be configured invarious ways, and the lens moving apparatus according to the embodimentmay move an optical module, which is constituted of at least one lens,in the first direction, which is parallel to the optical axis, orrelative to a plane defined by the second and third directions, whichare perpendicular to the first direction, thereby performing handshakecorrection motion and/or auto-focusing.

FIG. 1 is a schematic perspective view illustrating the lens movingapparatus 100 according to an embodiment, and FIG. 2 is an explodedperspective view of the lens moving apparatus 100 illustrated in FIG. 1. FIG. 3 is a perspective view of the lens moving apparatus 100 fromwhich a cover member 300 is removed, and FIG. 11 is a cross-sectionalview taken along line I-I′ of FIG. 3 .

Referring to FIGS. 1 to 3 and FIG. 11 , the lens moving apparatus 100includes a bobbin 110, a first coil 120, first magnets 130, a housing140, an upper elastic member 150, a second coil 230, a circuit board 250and conductive adhesive members 239 a and 239 b.

The lens moving apparatus 100 may further include a cover member 300, afirst position sensor 170, a second magnet 180, a magnetic compensationmetal 182, a base 210, a support member 220 and a second position sensor240.

First, the cover member 300 will be described.

The cover member 300 defines an accommodation space along with the base210, such that the upper elastic member 150, the bobbin 110, the firstcoil 120, the housing 140, the first magnets 130, the first positionsensor 170, the second magnet 180, the lower elastic member 160, aplurality of the support members 220, the second coil 230, the secondposition sensor 240 and the circuit board 250 are accommodated in theaccommodation space.

The cover member 300 may take the form of a box that has an open bottomand includes an upper plate and side plates. The bottom of the covermember 300 may be coupled to the top of the base 210. The upper plate ofthe cover member 300 may have a polygonal shape, such as, for example, asquare or octagonal shape.

The cover member 300 may have a bore formed in the upper plate thereofin order to expose a lens (not shown), coupled to the bobbin 110, tooutside light. In addition, the bore in the cover member 300 may beprovided with a window formed of a light-transmitting material, in orderto inhibit impurities, such as, for example, dust or moisture, fromentering a camera module.

Although the material of the cover member 300 may be a non-magneticmaterial such as, for example, SUS in order to inhibit the cover member300 from being attracted by the first magnets 130, the cover member 300may be formed of a magnetic material, and may function as a yoke.

Next, the bobbin 110 will be described.

The bobbin 110 is placed inside the housing 140, and is movable in thedirection of the optical axis or in the first direction, for example, inthe Z-axis direction, via electromagnetic interaction between the firstcoil 120 and the first magnets 130.

The bobbin 110 may be provided with a lens directly mounted or coupledthereto, without being limited thereto. The bobbin 110 or may include alens barrel (not shown) in which at least one lens is installed. Thelens barrel may be coupled inside the bobbin 110 in any of variousmanners.

The bobbin 110 may be configured to have a bore for mounting the lens orthe lens barrel. The bore may have a circular, elliptical, or polygonalshape, without being limited thereto.

FIG. 4 is a first perspective view showing the bobbin 110, the firstcoil 120, the first position sensor 170, the first magnets 130 and thesecond magnet 180, which are illustrated in FIG. 1 , and FIG. 5 is aplan view of FIG. 4 .

Referring to FIGS. 4 and 5 , the bobbin 110 may include first stoppers111 and winding protrusions 112. The first stoppers 110 may protrude ina first direction from the upper surfaces of the bobbin 110. Forexample, the first stoppers 111 may protrude upwards a first height h1from the upper surface of the bobbin 110. The first stopper 111 mayinhibit the upper surface of the bobbin 110 from directly colliding withthe inner surface of the upper plate of the cover member 300 even whenthe bobbin 110 moves beyond a predetermined range due to external impactor the like during movement of the bobbin 110 in the first direction toimplement an autofocusing function.

The first stoppers 111 may be configured to protrude upwards the uppersurface of the bobbin 110 while protruding from the side surface of thebobbin 110 in a direction perpendicular to the optical axis OA. Forexample, the first stoppers 111 may be disposed at an edge at which theupper surface of the bobbin 110 meets the side surface of the bobbin110.

The first stoppers 111 may be fitted in first seating grooves 146-1provided in the housing 140. Consequently, even when the bobbin 110 isforced in a rotational direction about the optical axis OA, it ispossible to inhibit the bobbin 110 from being rotated by means of thefirst stoppers 111 fitted in the first seating grooves 146-1 in thehousing 140.

The winding protrusions 112 protrude from an upper peripheral surface oran outer peripheral surface of the bobbin 110, and the first coil 120 iswound around the winding protrusions 112. Although two windingprotrusions 112 a and 112 b are illustrated in FIG. 4 , the disclosureis not limited thereto. Each of the starting wire and the terminatingwire of the first coil 120 may be wound around a corresponding one ofthe two winding protrusions 112.

For example, the winding protrusions 112 may protrude from the sidesurface of the bobbin in a direction perpendicular to the optical axisOA, and may be seated in or supported by second seating grooves 146-2provided in the housing 140.

The bobbin 110 may be provided on the upper surface thereof with uppersupport protrusions 113, which are fitted into through holes 151 a inthe upper elastic member 150. The bobbin 110 may be provided on thelower surface thereof with lower support protrusions (not shown), whichare fitted into through holes 161 a in the lower elastic member 160.

The bobbin 110 may be provided in the outer peripheral surface or theouter surface thereof with a first-coil-seating groove (not shown) inwhich the first coil 120 is disposed. For example, thefirst-coil-seating groove may be provided in the lower end of the outerperipheral surface of the bobbin 110.

The bobbin 110 may further be provided in the upper end of the outerperipheral surface thereof with a second-magnet-seating recess 115 inwhich the second magnet 180 is disposed or seated. In addition, thebobbin 110 may be provided in the upper end of the outer peripheralsurface thereof with a compensation metal recess (not shown) in which amagnetic field compensation metal is disposed or seated.

Next, the first coil 120 will be described.

The first coil 120 is disposed on the outer peripheral surface or theouter surface of the bobbin 110.

For example, the first coil 120 may be wound around the outer peripheralsurface of the bobbin 110 so as to be rotated clockwise orcounterclockwise about the optical axis OA.

For example, the first coil 120 may be directly wound around the outerperipheral surface or the outer surface of the bobbin 110, and may beconfigured to have a ring shape, without being limited thereto. Inanother embodiment, the first coil, which is wound around the outerperipheral surface of the bobbin, may be a coil block, which is rotatedin a direction perpendicular to the optical axis and is configured tohave a ring shape or a polygonal shape. The starting wire and theterminating wire of the first coil 120 may be wound around the windingprotrusions 112 and then secured thereto.

For example, the first coil 120 may be disposed on a lower area of theouter peripheral surface of the bobbin 110.

When a drive signal, for example, drive current or voltage, is suppliedto the first coil 120, the bobbin 110 may be moved by means ofelectromagnetic force caused by interaction between the first magnets130 and the first coil 120. The movement of the bobbin 110 in theoptical-axis direction may be controlled so as to allow the lens mountedon the bobbin 110 to be focused.

The first coil 120 may be disposed so as to correspond to or to face thefirst magnets 130 in a direction perpendicular to the optical axis.

Next, the housing 140 will be described.

The housing 140 accommodates therein the bobbin 110, and supports thefirst magnets 130.

FIG. 6 is a first perspective view of the housing 140 illustrated inFIG. 1 , and FIG. 7 is a second perspective view of the housing 140illustrated in FIG. 1 .

Referring to FIGS. 6 and 7 , the housing 140 may be configured to have ahollow column shape overall. For example, the housing 140 may have apolygonal cavity (for example, a square or octagonal shape) or acircular cavity.

Although the housing may be configured to have a polygonal shape, forexample, an octagonal shape, when viewed in a plan view, the disclosureis not limited thereto.

The housing 140 may include a plurality of side portions 141 and 142.

For example, the housing 140 may include first side portions 141 andsecond side portions 142. The first magnets 130 may be disposed ormounted on the first side portions 141, and the elastic support members220 may be disposed on the second side portions 142. Each of the secondside portions 142 may connect two adjacent first side portions 141 toeach other. For example, the side portions of the housing 140 may bereferred to as “corner portions” of the housing 140.

The housing 140 may include first seating portions 141 a, in which thefirst magnets 130 are disposed, and a second seating portion 172, inwhich the first position sensor 170 is disposed.

The first seating portions 141 a may be provided in the inner surface ofthe second side portions 142, and each of the first seating portions 141a may be formed so as to have a recess or mounting-hole shape having asize corresponding to the size of each of the first magnets. Forexample, in order to allow the first magnets 130 to be easily fitted inthe first seating portions 141 a, each of the first seating portions 141a may have an opening formed in the bottom surface of the first seatingportion 141 a that faces the second coil 230.

The first side portions 142 of the housing 140 may be respectivelyprovided in the outer surfaces thereof with escape recesses 142 a, eachhaving a predetermined depth, in which the elastic support members 220are disposed.

Furthermore, the housing 140 may include second stoppers 143, whichprotrude from the upper surface of the housing 140 in order to inhibitcollision with the cover member 300.

For example, the housing 140 may include four second stoppers 143, whichare spaced apart from one another. The second stoppers 143 may bepositioned so as to correspond to or be aligned with the first stoppers111 of the bobbin 110.

The second stoppers 143 of the housing 140 may be provided with thefirst seating grooves 146-1, in which the stoppers 111 are fitted orseated. The second stoppers 143 of the housing 140 may function to guidemounting positions of the upper elastic members 150.

The housing 140 may include guide protrusions 148 a and 148 b protrudingfrom the upper surface thereof, and guide grooves 149 a, 149 b, 149 cand 149 d formed in the upper surface thereof at both lateral sides ofthe guide protrusions 148 a and 148 b.

The guide protrusions 148 a and 148 b may be disposed between first endsor between second ends of the upper elastic members (for example, 150 aand 150 b) so as to cause the upper elastic members (for example, 150 aand 150 b) to be spaced apart from each other.

In order to absorb and buffer vibrations of the bobbin 110, the lensmoving apparatus 100 may further include damping members DA1 to DA4 (seeFIG. 3 ), each of which is disposed between the upper elastic member 150a or 150 b and the first or second guide protrusion 148 of the housing140.

Each of the guide grooves 149 a to 149 d may be configured to bedepressed from the upper surface of the housing 140, and may open ininward and outward directions of the housing 140.

Each of the first and second ends of the upper elastic members (forexample, 150 a and 150 b) may be disposed in a corresponding one of theguide grooves 149 a to 149 d. Although each of the first and second endsof the upper elastic members 150 a and 150 b may be spaced apart from acorresponding one of the guide grooves 149 a to 149 d of the housing140, the disclosure is not limited thereto. The two portions may be incontact with each other.

Each of the damping members DA1 to DA4 may be disposed between acorresponding one of the lateral side surfaces of the guide protrusions148 and a corresponding one of damping contact portions 150-1 to 150-4of the upper elastic members 150 a and 150 b.

Since each of the damping members DA1 to DA4 is disposed between acorresponding one of the lateral side surfaces of the guide protrusions148, which are parallel to the direction of movement of the bobbin 110,and a corresponding one of the damping contact portions 150-1 to 150-4,it may be easy to control a function of absorbing or bufferingvibrations of the bobbin 110 in the direction of movement of the bobbin110.

The housing 140 may include the second seating portion 172, which isprovided in the outer surface of one of the first side portions 141, andthe second seating portion may be formed so as to have a groove shape.

At the initial position of the bobbin 110, the second seating portion172 of the housing 140 may be aligned with or may overlap thesecond-magnet-seating recess of the bobbin 110 in a directionperpendicular to the optical axis.

The initial position of the bobbin 110 may be the starting position ofan AF operating unit when power is not applied to the first coil 120, ora position at which the AF operating unit is disposed when the upper andlower elastic members 150 and 160 are elastically deformed due to theweight of the AF operating unit.

In other words, the initial position of the bobbin 110 may be a positionat which the AF operating unit is disposed when gravity is appliedtoward the base 210 from the bobbin 110 or when gravity is applied inthe opposite direction, toward the bobbin 110 from the base 210. The AFoperating unit may include the bobbin 110 and components mounted on thebobbin 110.

The housing 140 may be provided on the upper surface thereof with firstcoupling portions 144, which are fitted into through holes 152 a in theupper elastic member 150. Furthermore, the housing 140 may be providedon the lower surface thereof with second coupling portions 145, whichare fitted into through holes 162 a in the lower elastic member 160.Although each of the first coupling portions 144 may be configured tohave a protrusion shape, the disclosure is not limited thereto. Inanother embodiment, each of the first coupling portions 144 may beconfigured to have a hole shape. Alternatively, although each of thesecond coupling portions 145 may be configured to have a hole shape, thedisclosure is not limited thereto. In another embodiment, each of thesecond coupling portions 145 may be configured to have a protrusionshape.

Next, the first position sensor 170 will be described.

The first position sensor 170 may be disposed in one of the first sideportions 141 of the housing 140. For example, the first position sensor170 may be disposed in the second seating portion in the housing 140.

The first position sensor 170 may create an output signal for detectingdisplacement of the bobbin 110 by detection of intensity of a magneticfield of the second magnet 180 mounted on the bobbin 110. For example,the output signal may be an output voltage or a detection voltage.

A controller included in the camera module may perform AF feedbackcontrol for the lens moving apparatus using the output signal detectedby the first position sensor 170.

The first position sensor 170 may be embodied as a hall sensor alone, ormay be embodied as a driver including a hall sensor. However, thedisclosure is not limited thereto, and any sensor may be used as long asit can detect variation in magnetic force.

Next, the first magnets 130 will be described.

The first magnets 130 are disposed on the housing 140. For example, thefirst magnets 130 may be disposed on the second side portions 142 or thecorner portions of the housing 140.

For example, the first magnets 130-1 to 130-4 may be disposed or mountedin the first seating portions 141 a in the housing 140. Although each ofthe first magnets 130 may be configured to have an approximatelytrapezoidal shape, which corresponds to the corner portion of thehousing 140, the disclosure is not limited thereto.

In another embodiment, the first magnets 130-1 to 130-4 may be disposedon the first side portions of the housing 140, and the first positionsensor may be disposed on one (for example, the first corner portion) ofthe second side portions or corner portions of the housing 140. Here,the second magnet 180 may be disposed on the outer surface of the bobbin110 corresponding to the first corner portion of the housing 140 so asto face the first position sensor 170.

Each of the first magnets 130-1 to 130-4 may be configured to have apolyhedral shape, for example, a rectangular parallelepiped shape.

Each of the first magnets 130-1 to 130-4 may be configured as a singlebody, and may be oriented such that a first surface thereof facing thefirst coil 120 is the N-pole and a second surface opposite the firstsurface is the S-pole 134, without being limited thereto, and theopposite configuration is also possible.

At least two first magnets 130 may be provided, and in the embodiment,four first magnets 130 may be installed.

Next, the second magnet 180 will be described.

The second magnet 180 is disposed on the outer peripheral surface or theouter surface of the bobbin 110.

The second magnet 180 may be positioned between two adjacent firstmagnets among the first magnets 130-1 to 130-4 (for example, 130-1 and130-4), which are adjacent to each other in a direction perpendicular tothe optical axis. The reason for this is to minimize the interference ofa magnetic field between the first magnets 130-1 to 130-4 and the secondmagnet 180.

Although the second magnet 180 may be disposed above the first coil 120so as to be spaced apart from the first coil 120, this embodiment is notlimited thereto.

For example, the second magnet 180 may overlap the first coil 120 in theoptical-axis direction or the first direction, without being limitedthereto.

For example, the second magnet 180 may not overlap the first coil 120 ina direction perpendicular to the optical axis.

The magnetic field compensation metal 182 is disposed on the outerperipheral surface or the outer surface of the bobbin 110. For example,the magnetic field compensation metal 182 may be disposed so as to facethe second magnet 180 in a direction perpendicular to the optical axis.

For example, the magnetic field compensation metal 182 and the secondmagnet 180 may be disposed on the outer peripheral surface of the bobbin110 so as to be aligned with each other along an imaginary line HL whichextends through the center of the bobbin 110 while being perpendicularto the optical axis.

For example, the second magnet 180 may not overlap any of the firstmagnets 130 in the optical-axis direction or the first direction.

The interaction between the first magnets 130 and the first coil 120 maybe interrupted or hindered due to a magnetic field generated from thesecond magnet 180. The magnetic field compensation metal 182 mayfunction to reduce the interruption of the interaction between the firstmagnets 130 and the first coil 120 attributable to the magnetic fieldgenerated from the second magnet 180.

For example, the magnetic field compensation metal 182 may be made of ametal, without being limited thereto. The magnetic field compensationmetal 182 may be made of a material having a magnetic property, forexample, a magnetic material or a magnet.

The magnetic field compensation metal 182 may be configured to have thesame shape as the second magnet 180. The magnetic field compensationmetal 182 may function to balance the weight of the second magnet 180mounted on the bobbin 110, thereby realizing precise AF operation.

In another embodiment, the lens moving apparatus 100 may not include thefirst position sensor 170, the second magnet 180 or the magnetic fieldcompensation metal 182.

At the initial position of the bobbin 110, each of the first magnets130-1 to 130-4 may be aligned with the first coil 120 or may overlap thefirst coil 120 in a direction perpendicular to the optical axis.

At the initial position of the bobbin 110, the first position sensor 170and the second magnet 180 may overlap each other in a directionperpendicular to the optical axis, without being limited thereto. Inanother embodiment, at the initial position of the bobbin 110, the firstposition sensor 170 and the second magnet 180 may not overlap each otherin a direction perpendicular to the optical axis.

Next, the upper elastic member 150 and the lower elastic member 160 willbe described.

The upper elastic member 150 is coupled to an upper portion (or theupper surface or the upper end) of the bobbin 110 as well as to an upperportion (or the upper surface or the upper end) of the housing 140. Thelower elastic member 160 is coupled to a lower portion (or the lowersurface or the lower end) of the bobbin 110 as well as to a lowerportion (the lower surface or the lower end) of the housing 140.

FIG. 9 is a perspective view of the upper elastic member 150 illustratedin FIG. 1 .

Referring to FIG. 9 , the upper elastic member 150 may include aplurality of upper elastic members or upper springs (for example, 150 aand 150 b), which are spaced apart from each other and which areconductively isolated from each other.

Each of the plurality of upper elastic members (for example, 150 a and150 b) may include a first inner frame 151 coupled to an upper portion(for example, the upper support protrusions 113) of the bobbin 110, afirst outer frame 152 coupled to an upper portion (for example, theupper frame support protrusions 144) of the housing 140, and a firstconnector 153 connecting the first inner frame 151 to the first outerframe 152.

At least one of the plurality of upper elastic members 150 a and 150 bmay further include damping contact portions 150-1 to 150-4 provided atthe first inner frame 151. The damping contact portions 150-1 to 150-4may protrude upwards from the upper surface of the first inner frame151, for example, in a direction toward the upper elastic member 150from the lower elastic member 160.

For example, each of the damping contact portions 150-1 to 150-4 may bean end of the first inner frame 151, which is bent upwards.

At least one of the plurality of upper elastic members 150 a and 150 bmay further include support member contact portions 150 a-1 and 150 b-1,which protrude from the first outer frame 152.

For example, the support member contact portions 150 a-1 and 150 b-1 mayprotrude upwards, for example, in a direction toward the upper elasticmember 150 from the lower elastic member 160.

The damping contact portions 150-1 to 150-4 may also be referred to as“first contact portions”, and the support member contact portions 150a-1 and 150 b-1 may also be referred to as “second contact portions”.

FIG. 10 is a perspective view of the lower elastic member 160illustrated in FIG. 1 .

Referring to FIG. 10 , the lower elastic member 160 may include aplurality of lower elastic members or lower springs (for example, 160 aand 160 b), which are spaced apart from each other and which areconductively isolated from each other.

Each of the plurality of lower elastic members (for example, 160 a and160 b) may include a second inner frame 161 coupled to a lower portion(for example, the lower support protrusions) of the bobbin 110, a secondouter frame 162 coupled to a lower portion (for example, the secondcoupling portions 145) of the housing 140, and a second connector 163connecting the second inner frame 161 to the second outer frame 162.

Each of the first and second connectors 153 and 163 may be bent once ormore so as to define a predetermined pattern. By positional variationand fine deformation of the first and second connectors 153 and 163,upward and/or downward movement of the bobbin 110 in the firstdirection, parallel to the optical axis, may be elastically supported.

At least one of the plurality of lower elastic members 160 a and 160 bmay include sensor contact portions 160 a-1, 160 a-2, 160 b-1 and 160b-2 provided at the second outer frame 162. The sensor contact portions160 a-1, 160 a-2, 160 b-1 and 160 b-2 may be portions of the secondouter frame 162 that protrude upwards.

For example, in order to inhibit an oscillation phenomenon of the bobbin110 during movement, a damper may be disposed between the firstconnector 153 of each of the upper elastic members 150 a and 150 b andthe upper surface of the bobbin 110. Furthermore, a damper (not shown)may be disposed between the second connector 163 of each of the lowerelastic members 160 a and 160 b and the lower surface of the bobbin 110.

Alternatively, a damper may be applied to a coupled portion between eachof the bobbin 110 and the housing 140 and the upper elastic member 150or to a coupled portion between each of the bobbin 110 and the housing140 and the lower elastic member 160. For example, the damper may bemade of gel-type silicone.

Next, the support members 220 will be described.

FIG. 8 is an assembled perspective view of the bobbin 110, the firstmagnets 130, the housing 140, the lower elastic member 160 and thesupport members 220, which are illustrated in FIG. 1 .

Referring to FIG. 8 , the support members 220 are disposed on the firstside portions 141 of the housing 140. The support members 220 mayinclude a plurality of support members.

At least one support member may be disposed on the outer surface of eachof the first sides 141 of the housing 140. For example, two supportmembers, which are conductively isolated from each other, may bedisposed on each of the first side portions 141 of the housing, withoutbeing limited thereto.

For example, the first to fourth support members 220-1 to 220-4 may berespectively disposed on the first side portions 141 of the housing 140,and may support the housing 140 and the bobbin 110 so as to cause thehousing 140 and the bobbin 110 to be spaced apart from the base 210.

Each of the first to fourth support members 220-1 to 220-4 may includetwo elastic support members 220 a-1 and 220 b-1, 220 a-2 and 220 b-2,220 a-3 and 220 b-3, or 220 a-4 and 220 b-4.

For example, the two elastic support members disposed on one of the sideportions of the housing 140, illustrated in FIG. 8 , may be configuredto be symmetrical with each other in a direction perpendicular to theoptical-axis direction (for example, in the x-axis or y-axis direction).

Each of the elastic support members 220 a-1 to 220 a-4 and 220 b-1 to220 b-4 may include an upper terminal portion 221, an elasticdeformation portion 223 and a lower terminal portion 224.

The upper terminal portion 221 may be coupled to the upper end of thefirst side portion 141 of the housing 140, for example, a couplingprotrusion. For example, the upper terminal portion 221 may include agroove portion or a through hole, which is coupled to the couplingprotrusion 147 of the housing 140.

Two elastic support members 220 a-1 and 220 b-1, which are selected fromamong the elastic support members 220 a-1 to 220 a-4 and the 220 b-1 to220 b-4, may be conductively connected to the support member contactportions 150 a-1 and 150 b-1 of the upper elastic members 150 a and 150b via solders or conductive adhesive members (see CP1 and CP2 in FIG. 3).

For example, opposite ends of the first coil 120 may be conductivelyconnected to the first inner frames 151 of the upper elastic members 150a and 150 b, and the elastic support members 220 a-1 and 220 b-1, whichare brought into conductive contact with the support member contactportions 150 a-1 and 150 b-1, may be conductively connected to thecircuit board 250. The circuit board 250 may supply a drive signal tothe first coil 120 by way of the elastic support members 220 a-1 and 220b-1 and the upper elastic members 150 a and 150 b.

Each of the elastic deformation portions 223 may extend from the upperterminal portion 221 in a direction parallel to the optical-axisdirection, and may be bent once or more so as to have a predeterminedpattern.

The lower terminal portion 224 may extend from the elastic deformationportion 223 and may be coupled to the base 210. One end of the lowerterminal portion 224 may be fitted or disposed in asupport-member-seating groove 214 provided in the base 210 and may besecurely coupled thereto using an adhesive member such as epoxy.

A damper may be disposed between each of the elastic support members 220a-1 to 220 a-4 and 220 b-1 to 220 b-4 and the housing 141. For example,the damper may be disposed between the elastic deformation portion 223and the first side portion 141 of the housing 140.

One end 224 b of at least one lower terminal portion 224 of the elasticsupport members 220 a-1 to 220 a-4 and 220 b-1 to 220 b-4 may be bondedto a corresponding one of first and second pads 15-1 to 15-8 and 252-1to 252-8 of the circuit board 250 via a solder or a conductive adhesivemember.

Upper terminal portions 221 of two elastic support members 220 a-2 and220 b-2, which are selected from among the elastic support members 220a-1 to 220 a-4 and 220 b-1 to 220 b-4, may be conductively connected tofirst and second pins of the first position sensor 170 via a solder or aconductive adhesive member (see CP3 and CP4 in FIG. 3 ). The lowerterminal portions 221 of the two selected elastic support members 220a-2 and 220 b-2 may be conductively connected to a corresponding one ofthe second pads 15-1 to 15-8 of the circuit board 250 (see CP7 and CP8in FIG. 3 ).

The sensor contact portions 160 a-1 and 160 b-1, which are provided atends of the second outer frames 162 of the lower elastic members 160 aand 160 b, may be conductively connected to third and fourth pins of thefirst position sensor 170 (see CP5 and CP6).

The sensor contact portions 160 a-2 and 160 b-2, which are provided atthe opposite ends of the second outer frames 162 of the lower elasticmembers 160 a and 160 b, may be conductively connected to the upperterminal portions 221 of two other elastic support members 220 a-3 and220 b-3, which are selected from among the elastic support members 220a-1 to 220 a-4 and 220 b-1 to 220 b-4 (see CP9 and CP10 in FIG. 8 ).

As described above, the first coil 120 may be conductively connected totwo of the second pads 15-1 to 15-8 of the circuit board 250 via, forexample, the elastic support members 220 a-1 and 220 b-1. The firstposition sensor 170 may be conductively connected to four other secondpads among the second pads 15-1 to 15-8 via the elastic support members220 a-2, 220 b-2, 220 a-3 and 220 b-3 and the lower elastic members 160a and 160 b. However, the disclosure is not limited thereto, and inanother embodiment, conductive connection between each of the first coil120 and the first position sensor 170 may be implemented in variousmanners via the upper elastic members 150 a and 150 b, the lower elasticmembers 160 a and 160 b and the support members 220-1 and 220-4.

Although each of the elastic support members 220 a-1 to 220 a-4 and 220b-1 to 220 b-4 is embodied as a leaf spring disposed on the first sideportion 141 of the housing 140 in the embodiment illustrated in FIG. 8 ,the disclosure is not limited thereto. In another embodiment, theelastic support members may be disposed on the second side portions 142of the housing 140, and may be embodied as coil springs, suspensionwires or the like. In a further embodiment, the elastic support membersmay be integrally formed with the upper elastic member 150.

Next, the second coil 230, the circuit board 250, the base 210 and thesecond position sensor 240 will be described.

FIG. 12 is an exploded perspective view of the second coil 230, thecircuit board 250 and the base 210, and FIG. 13 is an assembledperspective view of the second coil 230, the circuit board 250 and thebase 210, which are illustrated in FIG. 12 .

Referring to FIGS. 12 and 13 , the base 210 may have a borecorresponding to the bore in the bobbin 110 and/or the bore in thehousing 140, and may have a shape that corresponds to that of the covermember 300, for example, a square shape.

The base 210 may have a stepped portion 211, to which an adhesive isapplied when the cover member 300 is secured to the base 210 using theadhesive. Here, the stepped portion 211 may guide the cover member 300when being coupled to the cover member 300, and the lower end of thecover member 300 may come into contact with the stepped portion 211 ofthe base 210.

The base 210 may be provided in a peripheral area of the upper surfacethereof with the support-member-seating groove 214, having a depressedrecess shape, in which the support member 220 is fitted.

The end of the support member 220 may be fitted or disposed in thesupport-member-seating groove 214, and the support member 220 may besecured to the support-member-seating groove 214 via an adhesive or thelike.

The support-member-seating groove 214 may include one or moresupport-member-seating grooves, which are provided in peripheral areasof the upper surface of the base 210 that correspond to or are alignedwith the first side portions 141 of the housing 140 on which the supportmember 220 is mounted.

In addition, a seating groove 215 may be formed in the upper surface ofthe base 210 so that the second position sensor 240 may be disposed inthe seating groove 215.

For example, the base 210 may be provided in the upper surface thereofwith two seating grooves 215-1 and 215-2, and each of the first andsecond position sensors 240 a and 240 b may be disposed in acorresponding one of the seating grooves 215-1 and 215-2 of the base210. For example, imaginary lines connecting the centers of the seatinggrooves 215-1 and 215-2 to the center of the base 210 may intersect eachother. Although the angle defined between the imaginary lines may be anangle of 90° by way of example, the disclosure is not limited thereto.

For example, each of the seating grooves 215-1 and 215-2 of the base 210may be disposed at or near the center of a corresponding one 230-3 or230-2 of the second coils 230-1 to 230-4 so as to be aligned with thecenter of the second coil in the optical-axis direction or in the firstdirection. For example, the center of each of the first and secondposition sensors 240 a and 240 b, which are disposed in the seatinggrooves 215-1 and 215-2, may be aligned with or overlap a correspondingone of the second coils 230-3 and 230-2 in the optical-axis direction orin the first direction.

The second position sensors 240 may be disposed in the seating grooves215-1 and 215-2 in the base 210. The second position sensors 240 maydetect the intensity of a magnetic field of the first magnets 130disposed on the housing 140.

The second position sensor 240 may be embodied as a driver including ahall sensor, or may be embodied as a detection sensor alone, such as ahall sensor.

The second position sensor 240 may detect displacement of the housing140 relative to the base in the x-axis or y-axis direction, which isperpendicular to the optical axis OA.

The second position sensor 240 may include the first sensor 240 a fordetecting displacement of the housing 140 in the x-axis direction, andthe second sensor 240 b for detecting displacement of the housing 140 inthe x-axis direction.

The circuit board 250 may be disposed on the upper surface of the base210, and may have a bore corresponding to the bore in the bobbin 110,the bore in the housing 140 and/or the bore in the base 210.

The outer peripheral surface of the circuit board 250 may have a shapethat coincides with or corresponds to the upper surface of the base 210,for example, a square shape.

The second coil 230 may be disposed above the circuit board 250, and thesecond position sensor 240 may be disposed under the circuit board 250.

The circuit board 250 may be conductively connected to the first andsecond sensors 240 a and 240 b disposed thereunder, and may provide therespective first and second sensors 240 a and 240 b with a drive signal.The outputs of the first and second sensors 240 a and 240 b may beoutput to the circuit board 250.

The circuit board 250 may include at least one terminal rib 253, whichis bent at the upper surface thereof and is provided with a plurality ofterminals 251, which receive electrical signals from the outside.

The circuit board 250 may receive external power through the pluralityof terminals 251 provided on the terminal rib 253 of the circuit board250, and may supply drive signals or power to the first and second coils120 and 230 and the first and second position sensors 170 and 240. Thecircuit board 250 may outwardly output signals received from the firstand second position sensors 170 and 240.

In the embodiment, although the circuit board 250 may be embodied as aFlexible Printed Circuit Board (FPCB), the disclosure is not limitedthereto. The terminals 251 of the circuit board 250 may be directlyformed on the surface of the base 210 via, for example, a surfaceelectrode process.

The circuit board 250 may include the first pads 251-1 to 251-8conductively connected to the second coils 230-1 to 230-4, and thesecond pads 15-1 to 18-8 conductively connected to the support members220-1 to 220-4.

For example, the circuit board 250 may be provided on at least one sideof the upper surface thereof with two first pads (for example, 252-1 and252-2), which are spaced apart from each other, and two second pads (forexample, 15-1 and 15-2), which are spaced apart from each other. The twosecond pads (for example, 15-1 and 15-2) may be positioned between thetwo first pads (for example, 252-1 and 252-2).

The terminals 251 of the circuit board 250 may be conductively connectedto the first pads 251-1 to 251-8 and the second pads 15-1 to 15-8.

The second coil 230 may be disposed under the lower elastic member 160but above the circuit board 250.

The second coil 230 may be formed on a coil board or a circuit member231, which is provided separately from the circuit board 250. Forexample, the second coil 230 may be configured to have a fine pattern(FP) coil shape.

An adhesive member may be disposed between the coil board 231 and thecircuit board 250, and the coil board 231 may thus be secured to thecircuit board 250 by means of the adhesive member and the conductiveadhesive members 239 a and 239 b.

The coil board 231 may include the plurality of second coils 230-1 to230-4, which correspond to the first magnets 130-1 to 130-4, andconnectors, which are connected to first and second ends of the secondcoils 230-1 to 230-4.

Although the second coils 230-1 to 230-4 may be disposed on, forexample, the corner portions of the coil board 231 or the cornerportions of the upper surface of the coil board 231 so as to correspondto or to be aligned with the first magnets 130-1 to 130-4 in a directionparallel to the optical axis, the disclosure is not limited thereto. Inanother embodiment, the second coils may also be disposed on the sidesof the upper surfaces of the coil board 231.

Each of the second coils 230-1 to 230-4 may be embodied as a ring-shapedcoil block.

In the embodiment, although the four second coils 230-1 to 230-4 may bedisposed on the corners of the coil board 231 as illustrated in FIGS. 12and 13 , the disclosure is not limited thereto.

In another embodiment, the coil board 231 may be provided with onesecond coil for the second direction (for example, the x-axis direction)and one second coil for the third direction (for example, the y-axisdirection). In a further embodiment, the coil board 231 may also beprovided with four or more second coils.

Electromagnetic force may be generated by interaction between the firstmagnets 130-1 to 130-4, which are positioned so as to face one another,and the second coils 230-1 to 230-4, to which a drive signal issupplied. The housing 140 is moved in the second and/or third directionsusing the electromagnetic force, thereby implementing handshakecorrection.

The first end of each of the second coils 230-1 to 230-4 is bonded to acorresponding one of the first pads 252-1 to 252-8 of the circuit board250, and the second end of each of the second coils 230-1 to 230-4 isbonded to another corresponding one of the first pads 252-1 to 252-8 ofthe circuit board 250.

One or more connectors may be positioned between two adjacent secondcoils provided on the coil board 231.

As illustrated in FIG. 12 , for example, the second coils 230-1 to 230-4may be disposed on the corners of the upper surface of the coil board231, and two of the connectors may be disposed on each side of the uppersurface of the coil board 231 so as to be spaced apart from each other.

In order to bond the connectors of the coil board 231 to the first pads252-1 to 252-8 of the circuit board 250, the connectors of the coilboard 231 may be aligned with or may overlap the first pads 252-1 to252-8 of the circuit board 250 in a direction parallel to the opticalaxis.

Each of the connectors of the coil board 231 may include a correspondingone of recesses 235-1 to 235-8, which are depressed in the outer surfaceof the coil board 231, and a corresponding one of bonding portions 236-1to 236-8 provided adjacent to the corresponding one of the recess 235-1to 235-8.

For example, the bonding portions 236-1 to 236-8 may be provided onregions of the upper surface of the coil board 231 adjacent to therecesses 235-1 to 235-8.

The recesses 235-1 to 235-8 may be provided on at least one side of theupper surface of the coil board 231. For example, at least one recessmay be formed in each of sides of the upper surface of the coil board231. For example, two recesses may be provided in each of sides of theupper surface of the coil board 231 so as to be spaced apart from eachother.

For example, the recesses 235-1 to 235-8 may be provided in a firstsection S1 (see FIG. 12 ) of at least one side of the coil board 231.The first section S1 may be configured to be depressed relative tosecond sections S2. The second sections S2 may be the remaining regionof the at least one side of the upper surface of the coil board 231excluding the first section S1.

For example, the first section S1 of the coil board 231 may be thecentral region of the one side of the coil board 213, and the secondsections S2 may be regions between the first section S1 and cornersadjacent to the one side of the coil board 213.

In another embodiment, the first section may not be a depressedstructure, and the first section and the second sections of the coilboard 231 may be positioned on the same plane.

Each of the bonding portions 236-1 to 236-8 of the coil board 231 may beconductively connected to a corresponding one of the second coils 230-1to 230-8 via a wire or pattern formed on the coil board 231, withoutbeing limited thereto. The connections between first and second ends ofthe second coils 230-1 to 230-8 and the bonding portions 236-1 to 236-8of the coil board 231, which are illustrated in FIG. 12 , may bevariously implemented.

The coil board 231 may include a conductive layer (for example, a copperlayer) and an insulation layer disposed on the conductive layer. Thesecond coils 230-1 to 230-4 may be formed by patterning the conductivelayer, and the bonding portions 236-1 to 236-8 may be formed by removingparts of the insulation layer adjacent to the recesses 235-1 to 235-8 ofthe coil board 231 and thus partially exposing the conductive layer.

For example, two bonding portions may be disposed on each of the sidesof the upper surface of the coil board 231 so as to be spaced apart fromeach other.

FIG. 14 is an enlarged view of the dotted rectangular area in FIG. 13 .

Referring to FIG. 14 , each of the bonding portions 236-1 to 236-8 ofthe coil board 231 may be disposed so as to be aligned with or tooverlap a corresponding one of the first pads 252-1 to 252-8 of thecircuit board 250 in a direction parallel to the optical axis.

Each of the recesses 235-1 to 235-8 of the coil board 213 may expose acorresponding one of the first pads 252-1 to 252-8 of the circuit board250. For example, each of the recesses 235-1 to 235-8 may expose theupper surface of a corresponding one of the first pads 252-1 to 252-8.

Each of the recesses 235-1 to 235-8 of the coil board 231 may beconfigured to have a semicircular, semi-elliptical or polygonal shape,without being limited thereto. Each of the recesses 235-1 to 235-8 maybe configured to have any shape, as long as it exposes a correspondingone of the first pads 252-1 to 252-8.

Each of the bonding portions 236-1 to 236-8 may be provided on a regionof the upper surface of the coil board 231 within a predetermineddistance from a corresponding one of the recesses 235-1 to 235-8. Forexample, each of the bonding portions 236-1 to 236-8 may be configuredto have a semicircular, semi-elliptical or polygonal band.

The circuit pattern and the wiring pattern formed on the coil board 231are relatively simple, compared to the circuit pattern and the wiringpattern formed on the circuit board 250.

More specifically, no pattern, or only a simple circuit pattern orwiring pattern, is provided on the region of the coil board 231 betweenthe regions of the coil board 231 on which the second coils 230-1 to230-4 are formed. Consequently, the restriction on the space required toform the recesses 235-1 to 235-8 in the region between the outer surface12 b and the inner surface 12 a of the coil board 231 may be alleviated.Thus, the distance L1 between the center of one of the recesses 235-1 to235-8 and the inner surface 12 a of the coil board 231 may be freelydesigned.

Since the distance L1 between the center of one of the recesses 235-1 to235-8 and the inner surface 12 a of the coil board 231 may be freelyset, it is possible to position the recesses 235-1 to 235-8 in thevicinity of the inner surface 12 a of the coil board 231 inconsideration of the range required for electrical contact and bondingto the first pads 252-1 to 252-8.

Since it is possible to position the recesses 235-1 to 235-8 in thevicinity of the inner surface 12 a of the coil board 231, it is possibleto increase the spacing L2 between the edge of the coil board 231 and acorresponding one of the bonding portions 252-1 to 252-8.

The conductive adhesive members 239 a and 239 b function to bond thefirst pads 252-1 to 252-8 of the circuit board 250 to the bondingportions 252-1 to 252-8 of the coil board 231.

FIG. 15 is a view showing the conductive adhesive members 239 a and 239b for bonding the first pads 252-1 to 252-8 to the bonding portions252-1 to 252-8, which are illustrated in FIG. 14 .

Referring to FIG. 15 , the conductive adhesive members 239 a and 239 bmay be disposed on the upper surfaces of the first pads (for example,252-1 and 252-2) of the circuit board 250 and on the upper surfaces ofthe bonding portions 252-1 to 252-8 of the coil board 231, therebybonding the upper surfaces of the first pads (for example, 252-1 and252-2) to the upper surfaces of the bonding portions 252-1 to 252-8 andconnecting the them to each other.

The conductive adhesive members 239 a and 239 b bonded to the bondingportions 252-1 to 252-8 of the coil board 231 may be configured toprotrude from the upper surface of the coil board 231.

For example, the lower surfaces of the conductive adhesive members 239 aand 239 b may cover all of the upper surfaces of the first pads (forexample, 252-1 and 252-2) of the circuit board 250 and the uppersurfaces of the bonding portions 252-1 to 252-8 of the coil board 231.

The upper surfaces of the conductive adhesive members 239 a and 239 bmay protrude upwards from the upper surface of the coil board 231 so asto be positioned above the upper surface of the coil board 231.

For example, each of the conductive adhesive members 239 a and 239 b maybe disposed on a corresponding one of the first pads (for example, 252-1and 252-2) of the circuit board 250 and a corresponding one of thebonding portions 252-1 to 252-8 of the coil board 231, which are exposedthrough the recesses 235-1 to 235-8, and may thus come into contact withthe first pads (for example, 252-1 and 252-2) and the bonding portions252-1 to 252-8.

The conductive adhesive members 239 a and 239 b may be made ofconductive adhesive material, for example, solder or conductive paste,without being limited thereto.

The conductive adhesive members 239 a and 239 b may be positioned so asto be spaced apart from the outer surface or the edges p1 and p2 of thecircuit board 250 adjacent to the first pads 252-1 to 252-8.

For example, the conductive adhesive members 239 a and 239 b may bepositioned inside the outer surface or the edges p1 and p2 of thecircuit board 250 adjacent to the first pads 252-1 to 252-8.

First surfaces of the conductive adhesive members 239 a and 239 b, whichface toward the outside of the outer surface or the edges p1 and p2 ofthe circuit board 250, may have a linear shape or a flat surface, andsecond surfaces of the conductive adhesive members 239 a and 239 b mayhave a curved shape or a curved surface. Here, the second surfaces ofthe conductive adhesive members 239 a and 239 b may face the firstsurfaces of the conductive adhesive members 239 a and 239 b.

The conductive adhesive members 239 a and 239 b do not protrude outwardbeyond the edges p1 and p2 of the circuit board 250 adjacent to thefirst pads 252-1 to 252-8. For example, the first surfaces of theconductive adhesive members 239 a and 239 b may not protrude outwardbeyond the edges p1 and p2 of the circuit board 250. Consequently, it ispossible to inhibit electrical contact between the conductive adhesivemembers 239 a and 239 b and the elastic support members 220-1 to 220-4.

FIG. 16 a is a view showing typical bonding between a circuit board 18-1and a coil board 18-2, FIG. 16 b is an enlarged view of a first bondingregion 19-1 of FIG. 16 a , and FIG. 16 c is an enlarged view of a secondbonding region 19-2 of FIG. 16 a.

Referring to FIG. 16 a , the lower surface of the coil board 1802 isprovided with a pad, and the upper surface of the circuit board 18-1 isprovided with a bonding portion to be bonded to the pad of the coilboard 18-2.

The coil board 18-2 is positioned such that the lower surface thereoffaces upwards, and the circuit board 18-1 is positioned such that theupper surface thereof faces the lower surface of the coil board 18-2.Here, the circuit board 18-1 may be disposed on the coil board 18-2 suchthat the bonding portion provided on the upper surface of the circuitboard 18-1 is aligned with the pad provided on the lower surface of thecoil board 18-2.

After the circuit board 18-1 is disposed on the coil board 18-2, the padof the coil board 18-2 is bonded to the bonding portion of the circuitboard 18-1 by means of solders 21 a and 21 b.

The circuit board 18-1 is positioned such that the lower surface thereoffaces the upper surface of a base, and the combined structure in whichthe bonding portion of the circuit board 18-1 is bonded to the pad ofthe coil board 18-2 is coupled to the base.

Referring to FIG. 16 b , the first solder 21 a, which is positioned atone side of the upper surface of the circuit board 18-1 perpendicular tothe x-axis, protrudes from the edge X1 of the circuit board 18-1 in adirection perpendicular to the optical axis (for example, in the y-axisdirection).

Referring to FIG. 16 c , the second solder 21 b, which is positioned atone side of the upper surface of the circuit board 18-1 parallel to they-axis, protrudes from the edge Y1 of the circuit board 1801 in adirection perpendicular to the optical axis (for example, in the x-axisdirection).

Furthermore, because the first and second solders 21 a and 21 b protrudetoward the base from the lower surface of the circuit board 18-1, thebase has to be provided with additional recesses corresponding to thefirst and second solders 21 a and 21 b in order to stably mount thecircuit board 18-1 on the base.

Furthermore, because the circuit board 18-1 is provided with additionalcircuit patterns, the bonding portion of the circuit board 18-1 cannotbe freely designed, thereby restricting the size of the bonding portion.Hence, because the bonding portion has a reduced size, bonding forcebetween the first and second solders 21 a and 21 b and the bondingportion is reduced. As a result, the bonding portion is damaged orcracks may occur in the first and second solders 21 a and 21 b in theevent of an impact, and electrical connection may be interrupted.

FIG. 17 a is a view showing bonding between the circuit board 250 andthe coil board 231 according to the embodiment, FIG. 17 b is an enlargedview of a first bonding region 19-3 in FIG. 17 a , and FIG. 17 c is anenlarged view of a second bonding region 19-4 in FIG. 17 a.

Referring to FIG. 17 a , bonding portions (not shown) are provided onthe upper surface of the coil board 231, and the first pads 252-1 to252-8, which are to be bonded to the bonding portions of the coil board231, are provided on the upper surface of the circuit board 250.

The circuit board 250 is coupled to the upper surface of the base 210.Subsequently, the coil board 231 is disposed on the circuit board 250such that the bonding portions are aligned with the first pads 252-1 to252-8 of the circuit board 250.

The first pads 252-1 to 252-8 of the circuit board 250 are bonded to thebonding portions of the coil board 231 by means of the solders 239 a to239 c. Since the coil board 231 is bonded to the circuit board 250 afterthe circuit board 250 is coupled to the base 210, the embodiment mayhelp inhibit misalignment between the circuit board 250 and the coilboard 231.

The solders 239 a to 239 c may be structures that protrude upwards theupper surface of the circuit board 250 and the upper surface of the coilboard 231. Accordingly, the embodiment does not need additional recessesin the base 210 corresponding to the solders 239 a to 239 c in order tomount the circuit board 250 on the base 210. For example, the solders239 a to 239 c may not protrude downwards from the lower surface of thecircuit board 250.

Referring to FIG. 17 b , the solder 239 a, which is positioned at oneside of the upper surface of the circuit board 250 parallel to thex-axis, does not protrude from the edge X2 of the circuit board 250 in adirection perpendicular to the optical axis (for example, in the y-axisdirection).

Referring to FIG. 17 c , the solder 239 c, which is positioned at oneside of the upper surface of the circuit board 250 parallel to they-axis, does not protrude from the edge Y2 of the circuit board 250 in adirection perpendicular to the optical axis (for example, in the x-axisdirection). Consequently, the embodiment is able to inhibit anelectrical short between the solders 239 a and 239 b and the elasticsupport members 220-1 to 220-4.

Since the bonding portions 236-1 to 236-8 are provided on the coil board231, which has simpler circuit patterns or wiring patterns than thecircuit board 250, restriction on size of the bonding portions 236-1 to236-8 is alleviated, thus enabling freedom in design of the bondingportions 236-1 to 236-8. Consequently, the embodiment is able to inhibitdamage to the bonding portions and cracks in the solders attributable toimpact, which would otherwise be generated owing to reduction of bondingforce between the solders and the bonding portions of the coil board.

FIG. 18 is a perspective view of a lens moving apparatus 1000 accordingto another embodiment, and FIG. 19 is an exploded perspective view ofthe lens moving apparatus 1000 illustrated in FIG. 18 . FIG. 20 is anexploded perspective view of some components of the lens movingapparatus 1000 illustrated in FIG. 19 , and FIG. 21 is a cross-sectionalview taken along line X1-X2 in FIG. 18 . FIGS. 22 and 23 are explodedperspective views of some components of the lens moving apparatus 1000illustrated in FIG. 19 .

The lens moving apparatus 1000 may include a cover member 1100, a firstmovable unit 1200, a second movable unit 1300, a stationary unit 1400, afirst support member 1500, second support members 1600, and AF and OISfeedback sensors 1800. However, one or more of the cover member 1100,the first movable unit 1200, the second movable unit 1300, thestationary unit 1400, the first support member 1500, the second supportmembers 1600, and the AF and OIS feedback sensors 1800 of the lensmoving apparatus 1000 may be omitted or modified. In particular, the AFand OIS feedback sensors 1800 are components for autofocus feedbackcontrol and handshaking correction feedback control, and one or more ofthe sensors may be omitted.

One of an AF drive coil 1220, a drive magnet 1320 and an OIS drive coil1422 may be referred to as a ‘first drive unit’, another component maybe referred to as a ‘second drive unit’, and the one remaining componentmay be referred to as a ‘third drive unit’. The AF drive coil 1220, thedrive magnet 1320 and the OIS drive coil 1422 may be interchangeablydisposed with respect to one another.

One of the AF drive coil 1220 and the OIS drive coil 1422 may bereferred to as a ‘first coil’, and the other may be referred to as a‘second coil’.

The cover member 1100 may define the appearance of the lens movingapparatus 1000. The cover member 1100 may be configured to have theshape of an approximate rectangular parallelepiped having an openbottom. However, the shape of the cover member 1100 is not limitedthereto. The cover member 1100 may be made of a non-magnetic material.If the cover member 1100 is made of a magnetic material, the magneticforce of the cover member 1100 may affect the drive magnet 320. Thecover member 1100 may be made of a metal. More specifically, the covermember 1100 may be made of a metal plate. In this case, the cover member1100 may shield the interior against electromagnetic interference (EMI).Owing to these characteristics of the cover member 1100, the covermember 1100 may be referred to as an ‘EMI shield can’. The cover member1100 may inhibit electric waves, which are generated outside the lensmoving apparatus, from being introduced thereinto. Furthermore, thecover member 1100 may inhibit electric waves, which are generated insidethe cover member 1100, from being emitted outside.

The cover member 1100 may include a top plate 1101 and a side plate1102. The cover member 1100 may include the side plate 1102, whichextends downwards from the outer periphery of the top plate 1101. In anexample, the cover member 1100 may be coupled to a base 1430. The sideplate 1102 of the cover member 110 may be coupled at part thereof to thebase 1430. The lower end of the side plate 1102 of the cover member 1100may be disposed in a depressed portion 1435 in the base 1430. The innersurface of the side plate 1102 of the cover member 1100 may be broughtinto direct contact with the outer lateral side surface of the base1430. The inner surface of the side plate 1102 of the cover member 1100may be coupled to the base 1430 by means of an adhesive (not shown). Inanother example, the cover member 1100 may be directly coupled to theupper surface of a printed circuit board. The first movable unit 1200,the second movable unit 1300, the stationary unit 1400, the firstsupport member 1500 and the second support members 1600 may be disposedin the internal space defined by the cover member 1100 and the base1430. By virtue of this configuration, the cover member 1100 is able toprotect the internal components from external shocks and to inhibit theentry of external contaminants. The top plate 1101 may include anopening 1110. The side plate 1102 may extend downwards from the topplate 1101.

The cover member 1100 may include the opening 1110 and depressedportions 1120. The depressed portions 1120 in the cover member 1100 maybe omitted or modified.

The opening 1110 may be formed in the top plate 1101 of the cover member1100. The opening 1110 may function to allow a lens or a lens module 400(see FIG. 29 ) to be exposed upwards. The opening 1110 may be configuredto have a shape corresponding to that of the lens module. The size ofthe opening 1110 may be larger than the diameter of the lens module soas to allow the lens module to be mounted through the opening 1110.Light, which is introduced through the opening 1110, may pass throughthe lens module. Here, the light having passed through the lens modulemay be converted into an electric signal and may then be obtained as animage at an image sensor.

The depressed portions 1120 may be formed in the corners of the topplate 1101 of the cover member 1100. The embodiment may have acharacteristic by which the depressed portions serving as mechanicalstoppers for the housing 1310 are positioned at the corners of the covermember 1100. By virtue of this characteristic, the direction of movementof the housing 1310 may coincide with the direction of disposition ofthe mechanical stoppers. Here, stroke dispersion of the housing 1310 maybe reduced. For reference, the housing 1301 may move in a diagonaldirection by virtue of the drive magnets 1320, which are provided ascorner magnets.

The depressed portions 1120 may overlap at least part of stoppers 1316in a direction perpendicular to the optical axis. Accordingly, each ofthe depressed portions 1120 according to the embodiment may serve as amechanical stopper for the housing 1310, which functions in a diagonaldirection. The depressed portions 1120 may be formed by bending thecover member 1100. Here, the bent portions of the cover member 1100 maybe round. The round portions of the cover member 1100 may be referred toas “round portions”. The depressed portions 1120 may be integrallyformed with the cover member 1100.

When the cover member 1100 is viewed from above, each of the depressedportions 1120 may have an isosceles right triangular shape, withoutbeing limited thereto. The depressed portions 1120 may be disposed atthe four corners of the cover member 1100 so as to be symmetrical withone another. Here, the housing 1310 may be provided with four stoppers1316 corresponding to the four depressed portions 1120, without beinglimited thereto. Consequently, the four depressed portions 1120 mayserve as mechanical stoppers by virtue of interaction with the stoppers1316 in any of four directions corresponding to the diagonal directions.

Each of the depressed portions 1120 may include a stepped plate 1121 anda connecting plate 1122. However, one or more of the stepped plate 1121and the connecting plate 1122 of the depressed portion 1120 may beomitted or modified.

The stepped plate 1121 may be parallel to the top plate 1101 of thecover member 1100. Alternatively, the stepped portion 1121 may bepositioned so as not to be parallel to the top plate 1101 of the covermember 1100. The stepped plate 1121 may intersect the connecting plate1122. The stepped plate 1121 may be perpendicular to the side plate 1102of the cover member 1100. When viewed from above, the stepped plate 1121may have an isosceles right triangular shape, without being limitedthereto.

The connecting plate 1122 may connect the stepped plate 1121 to the topplate 1101 of the cover member 1100. The connecting plate 1122 may beperpendicular to the stepped plate 1121 and the top plate 1101 of thecover member 1100. The connecting plate 1122 may overlap the stopper1316 in a direction perpendicular to the optical axis. Accordingly, theconnecting plate 1122 may come into contact with the stopper 1316 of thehousing 1310. When the stopper 1316 of the housing 1310 comes intocontact with the connecting plate 1122, further movement of the housing1310 may be restricted. The connecting plate 1122 may be obliquelyconnected to the side plate 1102 of the cover member 1100. For example,the connecting plate 112 may be connected to the side plate 1102 of thecover member 1100 at an angle of 135°.

The first movable unit 1200 may be coupled to a lens module, which is acomponent of a camera module (the lens module may also be referred to asa component of the lens moving apparatus). The first movable unit 200may accommodate the lens module therein.

The outer peripheral surface of the lens module may be coupled to theinner peripheral surface of the first movable unit 1200. The firstmovable unit 1200 may be moved by virtue of interaction with the secondmovable unit 1300 and/or the stationary unit 1400. Here, the firstmovable unit 1200 may move along with the lens module. The first movableunit 1200 may move for the purpose of implementation of autofocusfunction. In this case, the first movable unit 1200 may be referred toas an ‘AF movable unit’. However, the disclosure is not limited toadaptation of the first movable unit 1200 only to implement an autofocusfunction. The first movable unit 1200 may also move for the purpose ofimplementation of handshake correction.

The first movable unit 1200 may include a bobbin 1210 and an AF drivecoil 1220. However, one or more of the bobbin 1210 and the AF drive coil1220 of the first movable unit 1200 may be omitted or modified.

The bobbin 1210 may be disposed in a bore 1311 in the housing 1311 so asto be moved in a direction parallel to the optical axis. The bobbin 1210may be disposed inside the housing 1310. The bobbin 1210 may be disposedin the bore 1311 in the housing 1310. The bobbin 1210 may move withrespect to the housing 1310 in the optical-axis direction. The bobbin1210 may be coupled to the lens module. The outer peripheral surface ofthe lens module may be coupled to the inner peripheral surface of thebobbin 1210. The AF drive coil 1220 may be coupled to the bobbin 1210.The AF drive coil 1220 may be coupled to the outer peripheral surface ofthe bobbin 1210. The lower portion of the bobbin 1210 may be coupled toa lower elastic member 1520. The upper portion of the bobbin 1210 may becoupled to the upper elastic member 1510.

The bobbin 1210 may include a bore 1211, a drive coupling portion 1212,an upper coupling portion 1213 and a lower coupling portion (not shown).However, one or more of the bore 1211, the drive coupling portion 1212,the upper coupling portion 1213 and the lower coupling portion of thebobbin 1210 may be omitted.

The bore 1211 may be formed inside the bobbin 1210. The bore 1211 may beformed so as to be open upwards and downwards. The lens module may becoupled to the bore 1211. The bore 1211 may be provided in the innerperipheral surface thereof with a threaded portion that corresponds to athreaded portion formed in the outer peripheral surface of the lensmodule. In other words, the bore 1211 may be threadedly coupled to thelens module. An adhesive is disposed between the lens module and thebobbin 1210. Here, the adhesive may be epoxy, which is hardened byultraviolet, heat or a laser.

The AF drive coil 1220 may be coupled to the driver coupling portion1212. The driver coupling portion 1212 may be formed on the outerperipheral surface of the bobbin 1210. The driver coupling portion 1212may be embodied as a groove, which is formed by depressing part of theouter peripheral surface of the bobbin 1210. Here, the driver couplingportion 1212 may receive at least part of the AF drive coil 1220. Thedriver coupling portion 1212 may be integrally formed with the outerperipheral surface of the bobbin 1210. In an example, the drivercoupling portion 1212 may be continuously formed along the outerperipheral surface of the bobbin 1210. Here, the AF drive coil 1220 maybe wound around the driver coupling portion 1212. In another example,the driver coupling portion 1212 may include a plurality of drivercoupling portions, which are spaced apart from each other. In this case,the AF drive coil 1220 may also include a plurality of AF drive coils,which are respectively coupled to the plurality of driver couplingportions 1212. In a further example, the driver coupling portion 1212may be configured so as to be open upwards and downwards. Here, the AFdrive coil 1220, which has been previously wound, may be fitted on thebobbin through the bore thereof and may be fitted in and coupled to thedriver coupling portion 1212.

The upper coupling portion 1213 may be coupled to the upper elasticmember 1510. The upper coupling portion 1213 may be coupled to an innerpart or a first inner frame 512 of the upper elastic member 1510. Theupper coupling portion 1213 may protrude upwards from the upper surfaceof the bobbin 1210. In an example, the protrusions of the upper couplingportion 1213 may be fitted in a groove or hole in the first inner frame1512 of the upper elastic member 1510. Here, the protrusions of theupper coupling portion 1213 may be fused by heat in the state of beingfitted in the holes in the first inner frame 1512, thereby securing theupper elastic member 1510 between the fused protrusions and the uppersurface of the bobbin 1210.

The lower coupling portion may be coupled to the lower elastic member1520. The lower coupling portion may be coupled to an inner part or asecond inner frame 1522 of the lower elastic member 1520. The lowercoupling portion may protrude downward from the lower surface of thebobbin 210. In an example, the protrusions of the lower coupling portionmay be fitted into the grooves or holes in the second inner frame 1522of the lower elastic member 1520 and may be coupled thereto. Here, theprotrusions of the lower coupling portion may be fused by heat in thestate of being fitted in the holes in the second inner frame 1522,thereby securing the lower elastic member 1520 between the fusedprotrusions and the lower surface of the bobbin 1210.

The AF drive coil 1220 may be disposed on the bobbin 1210. The AF drivecoil 1220 may be disposed on the outer peripheral surface of the bobbin1210. The AD drive coil 1220 may be directly wound around the bobbin1210. The AF drive coil 1220 may face the drive magnets 1320. Here, whena magnetic field is created around the AF drive coil 1220 by the supplyof current to the AF drive coil 1220, the AF drive coil 1220 may bemoved relative to the drive magnet 1320 by virtue of electromagneticinteraction between the AF drive coil 1220 and the drive magnets 1320.

The AF drive coil 1220 may perform electromagnetic interaction with thedrive magnets 1320. The AF drive coil 1220 may move the bobbin 1210 inthe optical-axis direction with respect to the housing 1310 by virtue ofthe electromagnetic interaction with the drive magnets 1320. In anexample, the AF drive coil 1220 may be a single coil, which isintegrally formed. In another example, the AF drive coil 1220 mayinclude a plurality of coils, which are spaced apart from each other.The AF drive coils 1220 may include four coils, which are spaced apartfrom each other. Here, the four coils may be disposed on the outerperipheral surface of the bobbin 1210 such that two adjacent coilsthereof define an angle of 90° therebetween.

The AF drive coil 1220 may include a pair of lead wires for the supplyof power. Here, the pair of lead wires of the AF drive coil 1220 may beconductively connected to first and second upper springs 1501 and 1502,which are components of the upper elastic member 1510.

In other words, power may be supplied to the AF drive coil 1220 by wayof the upper elastic member 1510. More specifically, power may besupplied to the AF drive coil 1220 by way of a printed circuit board, acircuit board 1410, the support members 1600 and the upper elasticmember 1510 in this order. Alternatively, power may be supplied to theAF drive coil 1220 by way of the lower elastic member 1520.

The second movable unit 1300 may accommodate therein at least part ofthe first movable unit 1200. The second movable unit 1300 may be movedby the first movable unit 1200 or may be moved along with the firstmovable unit 1200. The second movable unit 1300 may be moved by virtueof interaction with the stationary unit 1400. The second movable unit1300 may be moved for handshake correction. Here, the second movableunit 1300 may be referred to as an ‘OIS movable unit’. When the secondmovable unit 1300 is moved for handshake correction, the second movableunit 1300 may be moved along with the first movable unit 1200.

The second movable unit 1300 may include the housing 1310 and the drivemagnets 1320. However, one or more of the housing 1310 and the drivemagnets 1320 of the second movable unit 1300 may be omitted or modified.

The housing 1310 may be disposed outside the bobbin 1210. The housing1310 may accommodate therein at least part of the bobbin 1210. In anexample, the housing 1310 may be configured to have a rectangularparallelepiped shape. The housing 1310 may include four side surfacesand four corner portions, each of which is disposed between two adjacentside surfaces.

The drive magnets 1320 may be disposed on the housing 1310. The drivemagnets 1320 may be respectively disposed on the four corner portions.The housing 1310 may be disposed inside the cover member 1100. At leastpart of the outer peripheral surface of the housing 1310 may beconfigured to have a shape corresponding to that of the inner peripheralsurface of the cover member 1100. In particular, the outer peripheralsurface of the housing 1310 may be configured to have a shapecorresponding to that of the inner peripheral surface of the side plate1102 of the cover member 1100. The housing 1310 may be made of aninsulation material. The housing 1310 may be made of a material, whichis different from that of the cover member 1100.

The housing 1310 may be formed through injection molding inconsideration of productivity. The outer surface of the housing 1310 maybe spaced apart from the inner surface of the side plate 1102 of thecover member 1100. The housing 1310 may be moved for OIS drive in thespace defined between the housing 1310 and the cover member 1100. Theupper elastic member 1510 may be coupled to an upper portion of thehousing 1310. The lower elastic member 1520 may be coupled to a lowerportion of the housing 1310.

The housing 1310 may include the bore 1311, a driver coupling portion1312, a upper coupling portion 1313, a lower coupling portion (notshown), the stoppers 1316 and protrusions 1317. However, one or more ofthe bore 1311, the driver coupling portion 1312, the upper couplingportion 1313, the lower coupling portion (not shown), the stoppers 1316and the protrusions 1317 of the housing 1310 may be omitted or modified.

The bore 1311 may be formed in the housing 1310. The bore 1311 may beformed inside the housing 1310. The bore 1311 may be formed verticallythrough the housing 1310. The bobbin 1210 is disposed in the bore 1311.The bobbin 1210 may be movably disposed in the bore 1311. At least partof the bore 1311 may be configured to have a shape corresponding to thatof the bobbin 1210. The inner peripheral surface of the housing 1310,which defines the bore 1311, may be positioned so as to be spaced apartfrom the outer peripheral surface of the bobbin 1210. The innerperipheral surface of the housing 1310, which defines the bore 1311, maybe provided with a stopper, which protrudes inwards therefrom so as tomechanically restrict the movement of the bobbin 1210 in theoptical-axis direction.

The drive magnets 1320 may be coupled to the driver coupling portions1312. The driver coupling portions 1312 may be formed in the housing1310. The driver coupling portions 1312 may be formed in the innerperipheral surface of the housing 1310. In this case, the driver magnets1320 disposed in the driver coupling portions 1312 have an advantage inelectromagnetic interaction with the AF drive coil 1220 positionedinside the drive magnets 1320. The driver coupling portions 1312 may beopen at the lower ends thereof. In this case, This is advantageous fromthe aspect of electromagnetic interaction of the drive magnets 1320disposed in the driver coupling portions 1312 with the OIS drive coil1420 positioned under the drive magnets 1320. The driver couplingportions 1312 may be embodied as grooves, which are formed by depressingthe inner peripheral surface of the housing 1310 outwards. The drivercoupling portions 1312 may include a plurality of driver couplingportions. The plurality of driver coupling portions 1312 may berespectively provided with the drive magnets 1320 received therein. Inan example, the driver coupling portions 1312 may be composed of fourdriver coupling portions. The four driver coupling portions 1312 may berespectively provided with the drive magnets 1320 disposed therein. Thedriver coupling portions 1312 may be formed in the corner portions ofthe housing 1310.

The upper coupling portion 1313 may be coupled to the upper elasticmember 1510. The upper coupling portion 1313 may be coupled to a firstouter part 1511 of the upper elastic member 1510. The upper couplingportion 1313 may protrude upwards from the upper surface of the housing1310. In an example, protrusions of the upper coupling portion 1313 maybe fitted into grooves or holes in the first outer part or the firstouter frame 1511 of the upper elastic member 1510 and may be securedthereto. Here, the protrusions of the upper coupling portion 1313 may befused by heat in the state of being fitted in the holes in the firstouter frame 1511, thereby securing the upper elastic member 1510 betweenthe fused protrusions and the upper surface of the housing 1310.

The lower coupling portion may be coupled to the lower elastic member1520. The lower coupling portion may be coupled to a second outer partor a second outer frame 1521 of the lower elastic member 1520. The lowercoupling portion may protrude downwards from the lower surface of thehousing 1310. In an example, protrusions of the lower coupling portionmay be fitted into grooves or holes in the second outer frame 1521 ofthe lower elastic member 1520, and may be coupled thereto. Here, theprotrusions of the lower coupling portion may be fused by heat in thestate of being fitted in the holes in the second outer frame 1521,thereby securing the lower elastic member 1520 between the fusedprotrusions and the lower surface of the housing 1310.

The stopper 1316 may protrude from the corner region of the uppersurface of the housing 1310. The stopper 1316 may overlap at least partof the depressed portion 1316 in a direction perpendicular to theoptical axis. Here, the stopper 1316 may serve as a mechanical stopperfunctioning in diagonal directions by virtue of interaction between thestopper 1316 and the connecting plate 1122. In other words, when thehousing 1310 moves in a diagonal direction, the stopper 1316 comes intocontact with the connecting plate 1122 of the depressed portion 1120,thereby restricting further movement of the housing 1310. The stopper1316 may overlap the connecting plate 1122 in a direction perpendicularto the optical axis.

The outer surface of the stopper 1316 may face the inner surface of theconnecting plate 1122. The outer surface of the stopper 1316 may beparallel to the inner surface of the connecting plate 1122.Consequently, as the stopper 1316 moves, the outer surface of thestopper 1316 may come into surface contact with the connecting plate1122. In this case, since the contact area between the stopper 1316 andthe connecting plate 1122 is increased, stroke dispersion of the housing1310 can be reduced. The stopper 1316 may have a rectangularparallelepiped shape. The corner portions of the rectangularparallelepiped may be round.

The distance between the upper surface of the stopper 1316 and the lowersurface of the top plate 1101 of the cover member 1100 (see L1 in FIG.21 ) may be shorter than the distance between the upper surface of thehousing 1310 and the lower surface of the stepped plate 1121 (see L2 inFIG. 21 ). In this case, the stopper 1316 may also serve as a mechanicalstopper functioning in the optical-axis direction.

The protrusions 1317 may protrude from the side surface of the housing1310. The outer surface of the protrusion 1317 may face the innersurface of the side plate 1102 of the cover member 1100. The outersurface of the protrusion 1317 may be parallel to the inner surface ofthe cover member 1100. Here, the protrusion 1317 may serve as amechanical stopper functioning in the x-axis and/or y-axis direction byvirtue of interaction between the protrusion and the cover member 1100.

The drive magnets 1320 may be disposed on the housing 1310. The drivemagnets 1320 may be disposed outside the AF drive coil 1220. The drivemagnets 1320 may face the AF drive coil 1220. The drive magnets 1320 mayperform electromagnetic interaction with the AF drive coil 1220. Thedrive magnets 1320 may be disposed above the OIS drive coil 1420. Thedrive magnets 1320 may face the OIS drive coil 1420.

The drive magnets 1320 may perform electromagnetic interaction with theOIS drive coil 1420. The drive magnets 1320 may be used in bothautofocus and handshake correction functions. Alternatively, the drivemagnets 1320 may include a plurality of magnets, which are separatelyused in autofocus and handshake correction functions. The drive magnets1320 may be disposed on the corner regions of the housing 1310. Here,the drive magnets 1320 may be referred to as ‘corner magnets’. Each ofthe corner magnets may be configured to have a rectangularparallelepiped shape, with the inner lateral surface being greater thanthe outer lateral surface.

The drive magnets 1320 may include a plurality of magnets, which arespaced apart from each other. The drive magnets 1320 may include fourdrive magnets, which are spaced apart from each other. The four drivemagnets may be disposed such that two adjacent drive magnets thereofdefine an angle of 90° therebetween. In other words, the drive magnets1320 may be disposed at regular intervals on the four corners of thehousing 1310. In this case, it is possible to realize efficientemployment of the inner volume of the housing 1310. The drive magnets1320 may be bonded to the housing by means of adhesive.

The stationary unit 1400 may be disposed under the housing 1310. Thestationary unit 1400 may be disposed under the second movable unit 1300.The stationary unit 1400 may face the second movable unit 1300. Thestationary unit 1400 may support the second movable unit 1300 in amovable manner. The stationary unit 1400 may move the second movableunit 1300. At this time, the first movable unit 120 may also move alongwith the second movable unit 1300.

The stationary unit 1400 may include the circuit board 1410, the circuitmember 1420 and the base 1430. However, one or more of the circuit board1410, the circuit member 1420 and the base 1430 of the stationary unit1400 may be omitted or modified.

The circuit board 1410 may be disposed on the upper surface of the base1430. The circuit board 1410 may supply power to the circuit member1420. The circuit board 1410 may be coupled to the circuit member 1420.The circuit board 1410 may be coupled to the printed circuit boarddisposed under the base 1430. The circuit board 1410 may be disposedunder the lower surface of the circuit member 1420. The circuit board1410 may be disposed on the upper surface of the base 1430. The circuitboard 1410 may be disposed between the circuit member 1420 and the base1430.

The circuit board 1410 may include a flexible printed circuit board(FPCB). The circuit board 1410 may be bent at a partial region thereof.The circuit board 1410 may supply power to the AF drive coil 1220. In anexample, the circuit board 1410 may supply power to the AF drive coil1220 by way of the support members 1600 and the upper elastic member1510.

The circuit board 1410 may include a bore 1411 and a terminal rib 1412.However, one or more of the bore 1411 and the terminal rib 1412 of thecircuit board 1410 may be omitted or modified.

The bore 1411 may be formed in the circuit board 1410. The bore 1411 maybe formed in the central region of the circuit board 1410. The bore 1411may be formed through the circuit board 1410. The bore 1411 may allowlight, having passed through the lens module, to pass therethrough. Thebore 1411 may be configured to have a circular shape. However, the shapeof the bore 1411 is not limited thereto.

The terminal rib 1412 may be formed at the circuit board 1410. Theterminal rib 1412 may be formed by bending part of the circuit board1410 downwards. At least part of the terminal rib 1412 may be exposed tothe outside. The terminal rib 1412 may be coupled to the printed circuitboard disposed under the base 1430 through soldering. The lower end ofthe terminal rib 1412 may come into direct contact with the printedcircuit board. The terminal rib 1412 may be disposed at aterminal-coupling portion 1434 of the base 1430.

The circuit member 1420 may be disposed on the base 1430. The circuitmember 1420 may be disposed on the circuit board 1410. The circuitmember 1420 may be disposed on the upper surface of the circuit board1410. The circuit member 1420 may be disposed under the drive magnets1320. The circuit member 1420 may be disposed between the drive magnets1320 and the base 1430. The circuit member 1420 may face the drivemagnets 1320. Here, when a magnetic field is generated around thecircuit member 1420 by the supply of current to the circuit board 1420,the drive magnets 1320 are able to move with respect to the circuitmember 1420 by virtue of the electromagnetic interaction between thecircuit member 1420 and the drive magnets 1320. The circuit member 1420may perform electromagnetic interaction with the drive magnets 1320. Thecircuit member 1420 may move the housing 1310 and the bobbin 1210 withrespect to the base 1430 in a direction perpendicular to theoptical-axis direction by virtue of electromagnetic interaction with thedrive magnets 1320.

The circuit member 1420 may be provided in the corners thereof withescape cuts through which the support members 1600 pass, without beinglimited thereto. In another embodiment, the circuit member 1420 may beprovided with through holes through which the support members 1600 pass.

The circuit member 1420 may include a board portion 1421 and an OISdrive coil 1422. However, one or more of the board portion 1421 and theOIS drive coil 1422 of the circuit member 1420 may be omitted ormodified.

The board portion 1421 may be a circuit board. The board portion 1421may be an FPCB. The board portion 1421 may be integrally formed with theOIS drive coil 1422. The support members 1600 may be coupled to theboard portion 1421. The board portion 1421 may be provided with holes orescape cuts through which the support members 1600 pass. The lower endsof the support members 600 may be coupled to the lower surface of theboard portion 1421 through soldering. The board portion 1421 may have abore.

The board portion 1421 may have the bore formed therethrough. The borein the board portion 421 may be formed so as to correspond to the bore1411 in the board portion 1410.

The OIS drive coil 1422 may include at least one coil. The OIS drivecoil 1422 may be a fine pattern coil (FP coil), which is integrallyformed with the board portion 1421. The OIS drive coil 1422 may includea plurality of coils, which are spaced apart from each other. The OISdrive coil 1422 may include four coils, which are spaced apart from eachother. Here, the four coils may be disposed on the coil portion 1421such that two adjacent coils thereof define an angle of 90°therebetween. The four coils may be independently controlled. Power maybe supplied to the OIS drive coil 1422 by way of the printed circuitboard, the circuit board 1410 and the coil portion 1421.

The OIS drive coil 1422 may face the drive magnets 1320 in a directionparallel to the optical axis. Here, when a magnetic field is createdaround the OIS drive coil 1422 by the supply of current to the OIS drivecoil 1422, the drive coil 1422 is able to move with respect to the OISdrive coil 1422 by virtue of electromagnetic interaction between the OISdrive coil 1422 and the drive magnets 1320. The OIS drive coil 1422 mayperform electromagnetic interaction with the drive magnets 1320. The OISdrive coil 1422 is able to move the housing 1310 and the bobbin 1210with respect to the base 1430 in a direction perpendicular to theoptical axis by virtue of electromagnetic interaction with the drivemagnets 1320.

The base 1430 may be disposed on the lower surface of the circuit board1410. The circuit board 1410 may be disposed on the upper surface of thebase 1430. The OIS drive coil 1420 may be disposed on the base 1430. Thebase 1430 may be coupled to the cover member 1100. The base 1430 may becoupled to the lower end of the side plate 1102 of the cover member1100.

In a camera module, the base 1430 may be disposed on the upper surfaceof the printed circuit board (for example, a second holder 800 in FIG.29 ). Here, an additional holder member may be disposed between the base1430 and the printed circuit board. The base 1430 may serve as a sensorholder functioning to protect an image sensor mounted on the printedcircuit board.

The base 1430 may include a bore 1431, a contaminant collector (notshown), a sensor-coupling portion 1433, a terminal-coupling portion 1434and a depressed portion 1435. However, one or more of the bore 1431, thecontaminant collector, the sensor-coupling portion 1433, theterminal-coupling portion 1434 and the depressed portion 1435 of thebase 1430 may be omitted or modified.

The bore 1431 may be formed in the base 1430. The bore 1431 may beformed vertically through the base 1430. An infrared filter may bedisposed in the bore 1431. Here, the infrared filter may be coupled toan additional holder member disposed under the base 1430. Light, havingpassed through the bore 1431 of the lens module, may be introduced intoan image sensor. In other words, light, having passed through the lensmodule, may be introduced into the image sensor through the bore 411 inthe circuit board 1410 and the bore 1431 in the base 1430. The bore 1431may be configured to have a circular shape. However, the shape of thebore 1431 is not limited thereto.

The contaminant collector may collect contaminants, which are introducedinto the lens moving apparatus. The contaminant collector may include arecess, which is formed by depressing the upper surface of the base1430, and an adhesive portion disposed in the recess. The adhesiveportion may include an adhesive material. Contaminants, which areintroduced into the lens moving apparatus, may adhere to the adhesiveportion.

The OIS feedback sensor 1800 may be disposed in the sensor-couplingportion 1433. The sensor-coupling portion 1433 may accommodate at leastpart of the OIS feedback sensor 1800. The sensor-coupling portion 1433may be a groove, which is formed by depressing the upper surface of thebase 1430. The sensor-coupling portion 1433 may be positioned so as tobe spaced apart from the contaminant collector. The sensor-couplingportion 1433 may be composed of a plurality of grooves. For example, thesensor-coupling portion 1433 may be composed of two grooves. In thiscase, each of the two grooves is provided with the OIS feedback sensor1800 disposed therein.

The terminal rib 1412 of the circuit board 1410 may be disposed on theterminal-coupling portion 1434. The terminal-coupling portion 1434 maybe embodied as a groove, which is formed by depressing part of a lateralside surface of the base 1430. The terminal-coupling portion 1434 mayreceive at least part of the terminal rib 1412 of the circuit board1410. The terminal-coupling portion 1434 may have a width thatcorresponds to the width of the terminal rib 1412. The terminal-couplingportion 1434 may have a length that corresponds to the length of theterminal rib 1412 of the circuit board 1410.

The depressed portion 1435 may be formed in the side surface of the base1430. The depressed portion 1435 may be formed throughout the entireouter peripheral surface of the base 1430. The depressed portion 1435may be formed by depressing an upper portion of the side surface of thebase 1430. Alternatively, the depressed portion 1435 may be formed bycausing a lower portion of the side surface of the base 1430 toprotrude. The lower end of the side plate 1102 of the cover member 1100may be disposed in the depressed portion 1435.

The first support member 1500 may be coupled both to the bobbin 1210 andto the housing 1310.

The first support member 1500 may elastically support the bobbin 1210.At least part of the first support member 1500 may have elasticity. Thefirst support member 1500 may be referred to as a ‘first elasticmember’. The first support member 1500 may support the bobbin 1210 in amovable manner. The first support member 1500 may support the bobbin1210 such that the bobbin 1210 is movable with respect to the housing1310 in the optical-axis direction. In other words, the first supportmember 1500 may support the bobbin 1210 such that the bobbin 1210performs AF drive. In this case, the first support member 1500 may bereferred to as an ‘AF support member’.

The first support member 1500 may include the upper elastic member 510and the lower elastic member 520. However, one or more of the upperelastic member 1510 and the lower elastic member 1520 of the firstsupport member 1500 may be omitted or modified.

The upper elastic member 1510 may be disposed above the bobbin 1210, andmay be coupled both to the bobbin 1210 and to the housing 1310. Theupper elastic member 1510 may be coupled to both the bobbin 1210 and thehousing 1310. The upper elastic member 1510 may be coupled both to anupper portion of the bobbin 1210 and to an upper portion of the housing1310. The upper elastic member 1510 may elastically support the bobbin1210. At least part of the upper elastic member 1510 may haveelasticity. The upper elastic member 1510 may support the bobbin 1210 ina movable manner. The upper elastic member 1510 may support the bobbin1210 such that the bobbin 1210 is movable with respect to the housing1310 in the optical-axis direction. The upper elastic member 1510 may beembodied as a leaf spring.

The upper elastic member 1510 may include two upper springs 1501 and1502, which are spaced apart from each other. The two upper springs 1501and 1502 may be coupled to a pair of lead wires of the AF drive coil1220. The two upper springs 1501 and 1502 may be used as conductivelines for supplying power to the AF drive coil 1220. The upper springs1501 and 1502 may have elasticity. Here, each of the upper springs 1501and 1502 may be referred to as a “support unit” or “elastic unit”.

The upper elastic member 1510 may include the first outer frame 1511,the first inner frame 1512, a first connecting portion 1513 and acoupling portion 1514. However, one or more of the first outer frame1511, the first inner frame 1512, the first connecting portion 1513 andthe coupling portion 514 of the upper elastic member 1510 may be omittedor modified.

The first outer frame 1511 may be coupled to the housing 1310. The firstouter frame 1511 may be coupled to an upper portion of the housing 1310.The first outer frame 1511 may include a hole or groove, which iscoupled to the upper coupling portion 1313 of the housing 1310.

The first inner frame 1512 may be coupled to the bobbin 1210. The firstinner frame 1512 may be coupled to an upper portion of the bobbin 1210.The first inner frame 1512 may be coupled to the upper coupling portion1213 of the bobbin 1210. The first inner frame 1512 may include a holeor groove, which is coupled to the upper coupling portion 1213 of thebobbin 1210.

The first connecting portion 1513 may connect the first outer frame 1511to the first inner frame 1512. The connecting portion 1513 mayelastically connect the first outer frame 1511 to the first inner frame1512. The first connecting portion 1513 may have elasticity. Here, thefirst connecting portion 1513 may be referred to as a ‘first elasticportion’. The first connecting portion 1513 may be bent twice or more.

The coupling portion 1514 may be coupled to the second support members1600. The coupling portion 1514 may be coupled to the second supportmembers 1600 through soldering. In an example, the coupling portion 1514may include holes through which the second support members 1600 pass. Inanother example, the coupling portion 1514 may include grooves intowhich the second support members 1600 are coupled. The coupling portion1514 may extend from the first outer frame 1511. The coupling portion1514 may extend outwards from the first outer frame 1511. The couplingportion 1514 may include a bent portion.

The lower elastic member 1520 may be disposed under the bobbin 1210, andmay be coupled both to the bobbin 1210 and to the housing 1310. Thelower elastic member 1520 may be coupled both to the bobbin 1210 and tothe housing 1310. The lower elastic member 1520 may be coupled both to alower portion of the bobbin 1210 and to a lower portion of the housing1310. The lower elastic member 1520 may elastically support the bobbin1210. At least part of the lower elastic member 1520 may haveelasticity. The lower elastic member 1520 may support the bobbin 1210 ina movable manner. The lower elastic member 1520 may support the bobbin1210 such that the bobbin 1210 is movable with respect to the housing1310 in the optical-axis direction. The lower elastic member 1520 may beembodied as a leaf spring. In an example, the lower elastic member 1520may be integrally formed.

The lower elastic member 1520 may include the second outer frame 1521,the second inner frame 1522 and a second connecting portion 523.However, one or more of the second outer frame 1521, the second innerframe 1522 and the second connecting portion 1523 of the lower elasticmember 1520 may be omitted or modified.

The second outer frame 1521 may be coupled to the housing 1310. Thesecond outer frame 1521 may be coupled to a lower portion of the housing1310. The second outer frame 1521 may be coupled to the lower couplingportion of the housing 1310. The second outer frame 1521 may include ahole or groove, which is coupled to the lower coupling portion of thehousing 1310.

The second inner frame 1522 may be coupled to the bobbin 1210. Thesecond inner frame 1522 may be coupled to a lower portion of the bobbin210. The second inner frame 1522 may be coupled to the lower couplingportion of the bobbin 210. The second inner frame 1522 may include ahole or groove, which is coupled to the lower coupling portion of thebobbin 1210.

The second connecting portion 1523 may connect the second outer frame1521 to the second inner frame 1522. The second connecting portion 1523may elastically connect the second outer frame 1521 to the second innerframe 1522. The second connecting portion 1523 may have elasticity.Here, the second connecting portion 1523 may be referred to as an“elastic portion”. The second connecting portion 1523 may be bent twiceor more.

The second support members 1600 may be coupled both to the housing 1310and to the stationary unit 1400.

The second support members 1600 may support the housing 1310 in amovable manner. The second support members 1600 may elastically supportthe housing 1310. At least part of each of the second support members1600 may have elasticity. Here, the second support members 1600 may bereferred to as ‘second elastic members’. In an example, the secondsupport members 1600 may support the housing 1310 with respect to thestationary unit 1400 in a direction perpendicular to the optical-axisdirection. The bobbin 1210 may move along with the housing 1310. Inanother example, the second support members 1600 may support the housing1310 such that the housing 1310 is tiltable with respect to thestationary unit 1400. In other words, the second support members 1600may support the housing 1310 and the bobbin 1210 such that the housing1310 and the bobbin 1210 perform OIS drive. Here, the second supportmembers 1600 may be referred to as ‘OIS support members’. In an example,the second support members 1600 may be embodied as wires. In anotherexample, the second support members 1600 may be embodied as leafsprings.

The lower ends of the second support members 1600 may be coupled to thecircuit board 410. The second support members 1600 may extend throughthe circuit board 1410. In this configuration, the lower ends of thesecond support members 1600 may be coupled to the lower surface of thecircuit board 1410. The upper ends of the second support members 1600may be coupled to the coupling portion 1514 of the upper elastic member1510. The upper ends of the second support members 1600 may extendthrough the coupling portion 1514 of the upper elastic member 1510. Inthis configuration, the upper ends of the second support members 1600may be coupled to the upper surface of the coupling portion 1514 of theupper elastic member 1510 through soldering.

In a modification, the lower ends of the second support members 1600 maybe coupled to the board portion 1421 of the circuit member 1420, and thecircuit member 1420 may support the movable unit 1300 in a movablemanner.

In another embodiment, the lower ends of the second support members 1600may be coupled to the base 1430. The upper ends of the second supportmembers 1600 may be coupled to the housing 1310. The configuration ofthe second support members 1600 are not limited thereto, and anyconfiguration of the second support members 1600 may be provided as longas it is possible to support the second movable unit 1300 such that thesecond movable unit 1300 is movable with respect to the stationary unit1400.

The second support members 1600 may include a plurality of secondsupport members. The second support members 1600 may include a pluralityof wires. The upper ends of the plurality of wires may be coupled to theupper elastic member 1510. The lower ends of the plurality of wires maybe coupled to the circuit board 1410. The plurality of wires may be usedas conductive lines.

A damper (not shown) may be disposed at the second support members 1600.The damper may be disposed at the second support members 1600 and thehousing 1310. The damper may be disposed at the first support member1500. The damper may be disposed at the first support member 1500 and/orthe second support members 1600 so as to inhibit a resonance phenomenonfrom occurring in the first support member 1500 and/or the secondsupport members 1600. A shock absorber may be provided to one or more ofthe first support member 1500 and the second support members 1600. Theshock absorber may be formed by changing the shape of part of the firstsupport member 1500 and/or the second support members 1600.

The AF feedback sensor may be provided for autofocus feedback. The AFfeedback sensor may detect movement of the bobbin 1210 in theoptical-axis direction. The AF feedback sensor may detect an amount ofmovement of the bobbin 1210 in the optical-axis direction and mayprovide the controller with the detected amount of movement in realtime. The AF feedback sensor may be disposed at the bobbin 1210. The AFfeedback sensor may be disposed at the housing 1310. For example, the AFfeedback sensor may be a hall sensor. In this case, a sensing magnet,which is detected by the AF feedback sensor, may be further disposed.

The OIS feedback sensor 1800 may be provided for handshake correctionfeedback. The OIS feedback sensor 1800 may detect movement of thehousing 1310. The OIS feedback sensor 1800 may detect movement ortilting of the housing 1310 and/or the bobbin 1210 in a directionperpendicular to the optical-axis direction

The OIS feedback sensor 1800 may detect the intensity of a magneticfield of the drive magnets 1320. The OIS feedback sensor 1800 may detectthe intensity of a magnetic field of the drive magnets 1320 disposed atthe housing 1310. The OIS feedback sensor 1800 may detect the positionof the housing 1310. The OIS feedback sensor 1800 may detect the amountof movement of the housing 1320 in a direction perpendicular to theoptical axis. Here, the amount of movement of the housing 1310 in adirection perpendicular to the optical axis may correspond to the amountof movement of the bobbin 1210 and the lens module coupled to the bobbin1210.

The OIS feedback sensor 180 may be disposed at the stationary unit 1400.The OIS feedback sensor 180 may be disposed on the lower surface of thecircuit board 1410. The OIS feedback sensor 1800 may be conductivelyconnected to the circuit board 1410. The OIS feedback sensor 1800 may bedisposed at the base 1430. The OIS feedback sensor 1800 may beaccommodated in the sensor-coupling portion 1433 formed in the uppersurface of the base 1430. The OIS feedback sensor 1800 may be a hallsensor. The OIS feedback sensor 1800 may be a hall integrated circuit(Hall IC). The OIS feedback sensor 1800 may detect the magnetic force ofthe drive magnets 1320. In other words, the OIS feedback sensor 1800 maydetect variation in magnetic force attributable to movement of the drivemagnets 1320, and may thus detect an amount of displacement of thehousing 1310 when the housing 1310 moves. The OIS feedback sensor 1800may include a plurality of OIS feedback sensors. For example, two OISfeedback sensors 1800 may be provided so as to detect movement of thehousing 1310 in the x-axis and y-axis directions (the optical axis isthe z-axis).

FIG. 24 is a perspective view of a lens moving apparatus 2000 accordingto a further embodiment, and FIG. 25 is an exploded perspective view ofthe lens moving apparatus 2000 illustrated in FIG. 24 . FIG. 26 is anexploded perspective view of some components of the lens movingapparatus 2000 illustrated in FIG. 25 , and FIG. 27 is a perspectiveview of the lens moving apparatus 2000 illustrated in FIG. 24 , fromwhich a cover member 1100 a is removed. FIG. 28 is a cross-sectionalview taken along line Y1-Y2 in FIG. 24 .

The lens moving apparatus 2000 may include the cover member 1100 a, thefirst movable unit 1200, the second movable unit 1300, the stationaryunit 1400, the first support member 1500, the second support members1600 and the AF and OIS feedback sensors 1800.

The description of the cover member 1100, the first movable unit 1200,the second movable unit 1300, the stationary unit 1400, the firstsupport member 1500, the second support members 1600 and the AF and OISfeedback sensors 1800 of the lens moving apparatus 1000, which areillustrated in FIGS. 18 and 19 , may also be taken as a description ofthe cover member 1100 a, the first movable unit 1200, the second movableunit 1300, the stationary unit 1400, the first support member 1500, thesecond support members 1600 and the AF and OIS feedback sensors 1800 ofthe lens moving apparatus 2000. Hereinafter, a description will be givenof characteristics of this embodiment that are different from those ofthe embodiment illustrated in FIGS. 18 and 19 .

The depressed portion 1120 may be omitted in the embodiment illustratedin FIG. 24 , and a spacer 1900, which serves as the depressed portion1120, may be provided as a separate component independent of the covermember 1100.

The cover member 1100 a may be configured to have a rectangularparallelepiped shape with a lower surface being open. In other words,the cover member 1100 a illustrated in FIG. 14 may have no depressedportion 1120, compared to the embodiment illustrated in FIGS. 18 and 19.

The spacer 1900 may be disposed inside the upper corners of the covermember 1100 a. The spacer 1900 may be disposed above the housing 1310.At least part of the spacer 1900 may overlap the stoppers 1316 in adirection perpendicular to the optical axis. Consequently, the spacer1120 according to the embodiment may serve as a mechanical stopper forthe housing 1310, which functions in a diagonal direction.

The spacer 1900 may include corner portions 1910 and side portions 1920.However, one or more of the corner portions 1910 and the side portions1920 of the spacer 1900 may be omitted or modified.

The corner portions 1910 may be disposed inside the upper corners of thecover member 1100 a. The corner portions 1910 may be brought intocontact with the stoppers 1316 by the movement of the housing 1310.Accordingly, the corner portions 1910 may serve as mechanical stoppersfor the housing 1310. When viewed from above, each of the cornerportions 1910 may have the shape of an isosceles right triangle. Thethickness of the corner portion 1910 may correspond to the height of thedepressed portion 1120 (height of the connecting plate 1122) of theembodiment illustrated in FIGS. 18 and 19 . The corner portions 1910 maybe disposed at the four upper corners of the cover member 1100 a.Consequently, the four corner portions 1901 may serve as mechanicalstoppers, which interact with stoppers 1316 at four locations thatcorrespond to the diagonal directions. The four corner portions 1910 maybe connected to one another via the side portions 1920.

Since the corner portions 1910 of the spacer 1900, which serve asmechanical stoppers for the housing 1310, are positioned at the cornersof the cover member 1100 a, the directions of movement of the housing1310 may coincide with the directions of disposition of the mechanicalstopper. In this case, the stroke dispersion of the housing 1310 may bereduced. For reference, the housing 1310 may move in diagonal directionsby virtue of the drive magnets 1320, which are provided as cornermagnets.

The side portions 1920 may connect the plurality of corner portions 1910to each other. The side portions 1920 may be disposed at the side edgesof the cover member 1100 a, at which the top plate 1101 meets the sideplate 1102. The side portions 1920 may be coupled to the inner surfaceof the cover member 1100.

FIG. 29 is an exploded perspective view illustrating a camera module 200according to an embodiment.

Referring to FIG. 29 , the camera module 200 may include a lens module400, the lens moving apparatus 450, an adhesive member 710, a filter610, a first holder 600, a second holder 800, an image sensor 810, amotion sensor 820, a controller 830, and a connector 840.

The lens module 400 may be mounted in the bobbin 110 or 1210 of the lensmoving apparatus 450.

The lens moving apparatus 450 may be one of the lens moving apparatuses100, 1000 and 2000 according to the previous embodiments.

The lens module 400 may include at least one lens. The lens module 400may include a lens and a lens barrel. The lens module 400 may includeone or more lenses (not shown) and a lens barrel accommodating thelenses. The configuration of the lens module 400 is not limited to alens barrel, and the lens module 400 may have any other configuration aslong as the lens module can support one or more lenses. The lens module400 may be moved along with the bobbin 210 or 1210. The lens module 400may be coupled to the bobbin 210 or 1210 via an adhesive (not shown). Inan example, the lens module 400 may be threaded with the bobbin 210 or1210. The light that has passed through the lens module 400 may beradiated to the image sensor.

The first holder 600 may be located under the base 210 of the lensmoving apparatus 450. The filter 610 may be mounted on the first holder600, and the first holder 600 may have a raised portion 500 on which thefilter 610 is seated.

The adhesive member 612 may couple or attach the base 210 or 1430 of thelens moving apparatus 450 to the first holder 600. In addition to theattachment function described above, the adhesive member 612 may serveto inhibit contaminants from entering the lens moving apparatus 450.

The adhesive member 612 may be, for example, epoxy, thermohardeningadhesive, ultraviolet hardening adhesive or the like.

The filter 610 may serve to inhibit light within a specific frequencyband, having passed through the lens module 400, from being introducedinto the image sensor 810. The filter 610 may be aninfrared-light-blocking filter, without being limited thereto. Here, thefilter 610 may be oriented parallel to the X-Y plane.

The filter 610 may be disposed between the lens module 400 and the imagesensor 810. In an example, the filter 610 may be disposed at the firstholder 600, which is provided independently of the base 210 or 1430. Inanother example, the filter 610 may be mounted in the bore or throughhole 1431 in the base 210 or 1430.

The region of the first holder 600 in which the filter 610 is mountedmay be provided with a bore or a through hole so as to allow the lightthat passes through the filter 610 to be introduced into the imagesensor 810.

For example, the filter 610 may be made of film material or glassmaterial. The filter 610 may be manufactured by applying infraredscreening coating material to a flat plate-shaped optical filter such asa cover glass for protecting an imaging area. In an example, the filter610 may be an infrared-absorbing filter. In another example, the filter610 may be an infrared-reflecting filter.

The second holder 800 may be disposed under the first holder 600, andthe image sensor 810 may be mounted on the second holder 800. The lightthat passes through the filter 610 is introduced into the image sensor810 so as to form an image on the image sensor 810.

The second holder 800 may include, for example, various circuits,devices, and a controller in order to convert the image, formed on theimage sensor 810, into electrical signals and to transmit the electricalsignals to an external component.

The image sensor 810 may be mounted on the second holder 800 usingsurface-mount technology (SMT), and a circuit pattern may be formed onthe second holder 800. For example, the second holder 800 may beembodied as a circuit board, such as a PCB or FPCB, to which variousdevices are coupled. In another example, the image sensor may be coupledto the second holder 800 using a flip-chip mounting technology.

The image sensor 810 may receive an image contained in the lightintroduced through the lens moving apparatus, and may convert thereceived image into electrical signals.

The filter 610 and the image sensor 810 may be disposed so as to bespaced apart from each other while facing each other in the firstdirection.

For example, the image sensor 810 and the lens module 400 may bepositioned such that optical axes thereof coincide with each other. Inother words, the optical axis of the image sensor 810 may be alignedwith the optical axis of the lens module 400. Consequently, the imagesensor 810 may be irradiated with light that has passed through the lensmodule 400. The image sensor 810 may convert light, which is radiated toan effective imaging area, into electrical signals. The image sensor 810may be, for example, one of a charge-coupled device (CCD), a metal oxidesemiconductor (MOS), CPD and CID. However, the kind of the image sensoris not limited thereto, and the image sensor may have any configuration,as long as it is possible to convert incident light into electricalsignals.

The motion sensor 820 may be mounted on the second holder 800, and maybe conductively connected to the controller 830 through the circuitpattern formed on the second holder 800.

The motion sensor 820 outputs rotational angular speed informationregarding the movement of the camera module 200. The motion sensor 820may be embodied as a dual-axis or triple-axis gyro sensor or an angularspeed sensor.

The controller 830 may be mounted on the second holder 800, and may beconductively connected to the second position sensor 240 or 1800 and thesecond coil 230 or 1420 of the lens moving apparatus 450. For example,the second holder 800 may be conductively connected to the circuit board250 or 1410 of the lens moving apparatus 450, and the controller 820mounted on the second holder 800 may be conductively connected to thesecond position sensor 240 or 1800 and the second coil 230 or 1420through the circuit board 250 or 1410.

The controller 830 may output a driving signal, which is capable ofperforming handshake correction for the OIS movable unit of the lensmoving apparatus 450, based on output signals provided from the secondposition sensor 240 or 1800 of the lens moving apparatus 450.

The controller 830 may individually control direction, intensity,amplitude or the like of current supplied to the first coil 120 or 1220and the second coil 230 or 1420 of the lens moving apparatus 450.

The controller 830 may perform one or more of autofocus function and ahandshake correction function of the camera module 200 by controllingthe lens moving apparatus 450. In other words, the controller 830 maymove or tilt the lens module 400 in the optical axis direction or in adirection perpendicular to the optical axis by controlling the lensmoving apparatus 450. Furthermore, the controller 830 may perform one ormore of feedback control of autofocus function and feedback control ofhandshake correction function.

The controller 830 may perform feedback control of an autofocus functionin such a manner as to receive positions of the bobbin 210 and thehousing 310 detected by the first position sensor 170 and then tocontrol current applied to the first coil 120 or 1220 based on thereceived positional result.

For example, the first position sensor 170 disposed at the housing 140or 1310 detects a magnetic field of the second magnet 180, which is asensing magnet disposed at the bobbin 110 or 1210.

When the bobbin 110 or 1210 moves with respect to the housing 140 or1310, the amount of a magnetic field detected by the first positionsensor 170 varies. The first position sensor 170 detects an amount ofmovement of the bobbin 110 or 1210 or the position of the bobbin 110 or1210 in this way, and transmits the detected value to the controller830.

The controller 830 determines whether further movement of the bobbin 110or 1210 is performed based on the received detected value. Since thisprocedure is performed in real time, it is possible to more preciselyperform an autofocus function of the camera module according to theembodiment through autofocus feedback control.

In addition, the controller 830 may perform feedback control ofhandshake correction in such a manner as to receive positions of thebobbin 210 and the housing 1310 detected by the second position sensor240 or 1800 and then to control current applied to the second coil 230or 1420.

For example, when power or a driving signal is supplied to the secondcoil 230 or 1420, the magnets 130 or 1320 move with respect to thesecond coil 230 or 1420 by virtue of electromagnetic interaction betweenthe second coil 230 or 1420 and the magnets 130 or 1320. At this time,the housing 140 or 1310 with the magnets 130 or 1320 coupled theretomoves along with the magnets 130 or 1320. In other words, the housing140 or 1310 moves with respect to the base 210 or 1430 in a horizontaldirection (in a direction perpendicular to the optical axis). At thistime, the housing 140 or 1310 may be tilted with respect to the base 210or 1430. Meanwhile, as the housing 140 or 1310 moves in a horizontaldirection, the bobbin 110 or 1210 moves along with the housing 140 or1310. The movement of the housing 140 or 1310 causes the lens module 400coupled to the bobbin 110 or 1210 to be moved with respect to the imagesensor 810 in a direction parallel to a direction toward the imagesensor 810. In other words, the embodiment is able to perform handshakecorrection by supplying power to the second coil 230 or 1420.

In order to realize more precise handshake correction function of thecamera module, feedback control of handshake correction may beperformed. The second position sensor 240 or 1800 disposed on the base210 or 1430 detects a magnetic field of the magnets 130 or 1320 disposedon the housing 140 or 1310. Accordingly, when the housing 140 or 1310moves with respect to the base 210 or 1430, the size of a magnetic fielddetected by the second position sensor 240 or 1800 varies. The pair ofsensors 240 a and 240 b or 1800 detect an amount of movement or aposition of the housing 140 or 1310 in horizontal directions (in thex-axis and y-axis directions) in this way, and transmits the detectedvalue to the controller 830. The controller 830 determines whetherfurther movement of the housing 140 or 1310 is performed based on thereceived detected value. Since this procedure is performed in real time,it is possible to more precisely perform handshake correction functionof the camera module according to the embodiment through feedbackcontrol of handshake correction.

The connector 840 may be conductively connected to the second holder800, and may have a port for electrical connection of an externalcomponent.

The lens moving apparatus 100 according to the embodiment may beembedded in an optical instrument, which is intended to form an image ofan object in a space so as to increase a user's visual perception usingreflection, refraction, absorption, interference, diffraction and thelike, which are properties of light, which is intended to record animage formed through a lens and to reproduce the image, or which isintended to perform optical measurement, propagation or transmission ofan image or the like.

For example, the optical instrument according to the embodiment may beany one of a mobile phone, a smartphone, a portable smart device, adigital camera, a laptop computer, a digital broadcasting terminal, aPersonal Digital Assistant (PDA), a Portable Multimedia Player (PMP),and a navigation tablet PC, but is not limited thereto. The opticalinstrument is not limited thereto, and any kind of device for capturingan image or a photograph may be referred to as the optical instrument.

FIG. 30 is a perspective view illustrating a portable terminal 200Aaccording to an embodiment. FIG. 31 is a view illustrating theconfiguration of the portable terminal illustrated in FIG. 30 .

Referring to FIGS. 30 and 31 , the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an audio/video (A/V) input unit 720, a sensingunit 740, an input/output unit 750, a memory unit 760, an interface unit770, a controller 780, and a power supply unit 790.

The body 850 illustrated in FIG. 30 has a bar shape, without beinglimited thereto, and may be any of various types such as, for example, aslide type, a folder type, a swing type, or a swivel type, in which twoor more sub-bodies are coupled so as to be movable relative to eachother.

The body 850 may include a case (e.g. casing, housing, or cover)defining the external appearance of the terminal. For example, the body850 may be divided into a front case 851 and a rear case 852. A varietyof electronic components of the terminal may be mounted in the spacedefined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast reception module 711, amobile communication module 712, a wireless Internet module 713, anearfield communication module 714, and a location information module715.

The A/V input unit 720 serves to input audio signals or video signals,and may include, for example, a camera 721 and a microphone 722.

The camera 721 may be the camera module 200 illustrated in FIG. 30 .

The sensing unit 740 may sense the current state of the terminal 200A,such as, for example, the opening or closing of the terminal 200A, thelocation of the terminal 200A, the presence of a user's touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. For example, when the terminal 200A is aslide-type phone, the sensing unit 740 may detect whether the slide-typephone is open or closed. In addition, the sensing unit 740 serves tosense, for example, whether power is supplied from the power supply unit790, or whether the interface unit 770 is coupled to an externalcomponent.

The input/output unit 750 serves to generate, for example, visual,audible, or tactile input or output. The input/output unit 750 maygenerate input data to control the operation of the terminal 200A, andmay display information processed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touch screen panel 753. Thekeypad unit 730 may generate input data in response to input to akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich varies in response to electrical signals. For example, the displaymodule 751 may include at least one of a liquid crystal display, athin-film transistor liquid crystal display, an organic light-emittingdiode display, a flexible display and a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in, for example, a call-signal-receivingmode, a call mode, a recording mode, a voice recognition mode, or abroadcast-receiving mode, or may output audio data stored in the memoryunit 760.

The touch screen panel 753 may convert variation in capacitance, causedby a user's touch on a specific region of a touch screen, intoelectrical input signals.

The memory unit 760 may store programs for the processing and control ofthe controller 780, and may temporarily store input/output data (e.g. aphone book, messages, audio, still images, pictures, and moving images).For example, the memory unit 760 may store images captured by the camera721, for example, pictures or moving images.

The interface unit 770 serves as a passage for connection between theterminal 200A and an external component. The interface unit 770 mayreceive power or data from the external component, and may transmit thesame to respective constituent elements inside the terminal 200A, or maytransmit data inside the terminal 200A to the external component. Forexample, the interface unit 770 may include, for example, awired/wireless headset port, an external charger port, a wired/wirelessdata port, a memory card port, a port for the connection of a devicehaving an identification module, an audio input/output (I/O) port, avideo I/O port, and an earphone port.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to, for example, voice calls, data communication, and videocalls.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be provided inside thecontroller 780, or may be provided separately from the controller 780.

The controller 780 may perform pattern recognition processing, by whichwriting or drawing input to a touch screen is perceived as charactersand images, respectively.

The power supply unit 790 may supply power required to operate therespective constituent elements upon receiving external power orinternal power under the control of the controller 780.

The features, configurations, effects and the like described above inthe embodiments are included in at least one embodiment, but are notnecessarily limited to only one embodiment. In addition, the features,configuration, effects and the like exemplified in the respectiveembodiments may be combined with other embodiments or modified by thoseskilled in the art. Accordingly, content related to these combinationsand modifications should be construed as falling within the scope of theembodiments.

INDUSTRIAL APPLICABILITY

The embodiments may be applied to a lens moving apparatus, which iscapable of inhibiting electrical short between solders and supportmembers, damage to bonding portions of a coil board and generation ofcracks in solders, and a camera module and an optical device eachincluding the lens moving apparatus.

The invention claimed is:
 1. A lens moving apparatus comprising: a covermember comprising a top plate and a depressed portion formed in a cornerof the top plate; a housing disposed on the cover member and comprisinga corner portion; a bobbin disposed in the housing; a magnet disposed onthe housing; a first coil disposed on the bobbin; a base disposed underthe housing; and a second coil disposed to face the magnet, wherein thehousing is configured to move by an interaction between the magnet andthe second coil, wherein the housing comprises a stopper protruding froman upper surface of the corner portion thereof, and wherein thedepressed portion overlaps at least a part of the stopper in a directionperpendicular to an optical axis.
 2. The lens moving apparatus accordingto claim 1, wherein the depressed portion comprises: a stepped plate;and a connecting plate connecting the stepped plate and the top plate ofthe cover member.
 3. The lens moving apparatus according to claim 2,wherein an outer surface of the stopper faces an inner surface of theconnecting plate.
 4. The lens moving apparatus according to claim 2,wherein the stepped plate is in parallel to the top plate of the covermember.
 5. The lens moving apparatus according to claim 1, wherein thedepressed portion has an isosceles right triangular shape, when thecover member is viewed from above.
 6. The lens moving apparatusaccording to claim 1, comprising: an upper elastic member coupled withthe bobbin and the housing; a circuit board disposed on the base; and asupport member coupled with the upper elastic member and electricallyconnected to the circuit board.
 7. The lens moving apparatus accordingto claim 6, comprising a circuit member disposed on the circuit board,wherein the circuit member comprises a board portion and the second coilis formed in the board portion.
 8. The lens moving apparatus accordingto claim 6, wherein the upper elastic member comprises an inner framecoupled to the bobbin, an outer frame coupled to the housing, and aconnecting portion connecting the inner frame and the outer frame, andwherein one end of the support member is connected to the outer frameand another end of the support member is connected to the circuit board.9. The lens moving apparatus according to claim 2, wherein theconnecting plate overlaps the stopper of the housing in a directionperpendicular to an optical axis.
 10. The lens moving apparatusaccording to claim 1, wherein the depressed portion comprises a bentportion formed by bending the cover member, and wherein the bent portionof the depressed portion is round.
 11. The lens moving apparatusaccording to claim 1, wherein the top plate comprises four corners, andthe depressed portion is formed at each of the four corners of the topplate.
 12. The lens moving apparatus according to claim 11, wherein thehousing comprises four corners, and the stopper is formed at each of thefour corners of the housing.
 13. The lens moving apparatus according toclaim 1, wherein a distance between an upper surface of the stopper anda lower surface of the top plate is shorter than a distance between thelower surface of the top plate and the upper surface of the cornerportion of the housing.
 14. The lens moving apparatus according to claim1, wherein the depressed portion is not overlapped with the stopper in adirection in parallel to the optical axis.
 15. The lens moving apparatusaccording to claim 2, wherein the stopper is configured to be amechanical stopper operating in a diagonal direction by an interactionbetween the stopper and the connecting plate.
 16. A lens movingapparatus comprising: a base; a circuit board disposed on the base; acover member coupled to the base; a housing disposed on the covermember; a bobbin disposed in the housing; a magnet disposed on thehousing; an upper elastic member coupled to the housing and the bobbin;a first coil disposed on the bobbin; a support member coupled with theupper elastic member and electrically connected to the circuit board;and a second coil disposed to face the magnet, wherein the housing isconfigured to move by an interaction between the magnet and the secondcoil, wherein the cover member comprises a top plate and a steppedportion depressed from the top plate, wherein the housing comprises astopper protruding from an upper surface of the housing; wherein the topplate of the cover member overlaps the stopper of the housing in anoptical axis direction, and wherein the stepped portion of the covermember overlaps the support member in the optical axis direction. 17.The lens moving apparatus according to claim 16, wherein the depressedportion is not overlapped with the stopper in the optical axisdirection.